Ke Chu, Cheng-chang Jia, Xue-bing Liang, and Hui Chen, Effect of sintering temperature on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering, Int. J. Miner. Metall. Mater., 17(2010), No. 2, pp. 234-240. https://doi.org/10.1007/s12613-010-0220-0
Cite this article as:
Ke Chu, Cheng-chang Jia, Xue-bing Liang, and Hui Chen, Effect of sintering temperature on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering, Int. J. Miner. Metall. Mater., 17(2010), No. 2, pp. 234-240. https://doi.org/10.1007/s12613-010-0220-0
Ke Chu, Cheng-chang Jia, Xue-bing Liang, and Hui Chen, Effect of sintering temperature on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering, Int. J. Miner. Metall. Mater., 17(2010), No. 2, pp. 234-240. https://doi.org/10.1007/s12613-010-0220-0
Citation:
Ke Chu, Cheng-chang Jia, Xue-bing Liang, and Hui Chen, Effect of sintering temperature on the microstructure and thermal conductivity of Al/diamond composites prepared by spark plasma sintering, Int. J. Miner. Metall. Mater., 17(2010), No. 2, pp. 234-240. https://doi.org/10.1007/s12613-010-0220-0
Spark plasma sintering was used to fabricate Al/diamond composites. The effect of sintering temperature on the microstructure and thermal conductivity (TC) of the composites was investigated with the combination of experimental results and theoretical analysis. The composite sintered at 550℃ shows high relative density and strong interfacial bonding, whereas the composites sintered at lower (520℃) and higher (580–600℃) temperatures indicate no interfacial bonding and poor interfacial bonding, respectively. High relative density and strong interfacial bonding can maximize the thermal conductivity of Al/diamond composites, and taking both effects of particle shape and inhomogeneous interfacial thermal conductance into consideration can give a fairly good prediction of composites’ thermal conduction properties.
Spark plasma sintering was used to fabricate Al/diamond composites. The effect of sintering temperature on the microstructure and thermal conductivity (TC) of the composites was investigated with the combination of experimental results and theoretical analysis. The composite sintered at 550℃ shows high relative density and strong interfacial bonding, whereas the composites sintered at lower (520℃) and higher (580–600℃) temperatures indicate no interfacial bonding and poor interfacial bonding, respectively. High relative density and strong interfacial bonding can maximize the thermal conductivity of Al/diamond composites, and taking both effects of particle shape and inhomogeneous interfacial thermal conductance into consideration can give a fairly good prediction of composites’ thermal conduction properties.
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