Hui Chen, Cheng-chang Jia, and Shang-jie Li, Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration, Int. J. Miner. Metall. Mater., 20(2013), No. 2, pp. 180-186. https://doi.org/10.1007/s12613-013-0711-x
Cite this article as:
Hui Chen, Cheng-chang Jia, and Shang-jie Li, Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration, Int. J. Miner. Metall. Mater., 20(2013), No. 2, pp. 180-186. https://doi.org/10.1007/s12613-013-0711-x
Hui Chen, Cheng-chang Jia, and Shang-jie Li, Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration, Int. J. Miner. Metall. Mater., 20(2013), No. 2, pp. 180-186. https://doi.org/10.1007/s12613-013-0711-x
Citation:
Hui Chen, Cheng-chang Jia, and Shang-jie Li, Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration, Int. J. Miner. Metall. Mater., 20(2013), No. 2, pp. 180-186. https://doi.org/10.1007/s12613-013-0711-x
Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration
Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature (HPHT) infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters (temperature, pressure, and time). The improvement in interfacial bonding strength and the maximum thermal conductivity of 750 W/(m·K) were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.
Effect of sintering parameters on the microstructure and thermal conductivity of diamond/Cu composites prepared by high pressure and high temperature infiltration
Pure Cu composites reinforced with diamond particles were fabricated by a high pressure and high temperature (HPHT) infiltration technique. Their microstructural evolution and thermal conductivity were presented as a function of sintering parameters (temperature, pressure, and time). The improvement in interfacial bonding strength and the maximum thermal conductivity of 750 W/(m·K) were achieved at the optimal sintering parameters of 1200℃, 6 GPa and 10 min. It is found that the thermal conductivity of the composites depends strongly on sintering pressure. When the sintering pressure is above 6 GPa, the diamond skeleton is detected, which greatly contributes to the excellent thermal conductivity.
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