Hui-zhen Huang, Xiu-qin Wei, Dun-qiang Tan, and Lang Zhou, Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy, Int. J. Miner. Metall. Mater., 20(2013), No. 6, pp. 563-567. https://doi.org/10.1007/s12613-013-0766-8
Cite this article as:
Hui-zhen Huang, Xiu-qin Wei, Dun-qiang Tan, and Lang Zhou, Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy, Int. J. Miner. Metall. Mater., 20(2013), No. 6, pp. 563-567. https://doi.org/10.1007/s12613-013-0766-8
Hui-zhen Huang, Xiu-qin Wei, Dun-qiang Tan, and Lang Zhou, Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy, Int. J. Miner. Metall. Mater., 20(2013), No. 6, pp. 563-567. https://doi.org/10.1007/s12613-013-0766-8
Citation:
Hui-zhen Huang, Xiu-qin Wei, Dun-qiang Tan, and Lang Zhou, Effects of phosphorus addition on the properties of Sn-9Zn lead-free solder alloy, Int. J. Miner. Metall. Mater., 20(2013), No. 6, pp. 563-567. https://doi.org/10.1007/s12613-013-0766-8
School of Materials Science and Engineering, Nanchang University, Nanchang, 330031, China
中文摘要
This article explores the effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn-9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-9Zn solder alloy.
This article explores the effects of phosphorus addition on the wettability between Sn-9Zn solder alloy and Cu substrates, the oxidation behavior and the corrosion behavior of Sn-9Zn solder alloy. Spreading test was used to characterize the wettability of Sn-9Zn-xP solder alloys to Cu substrates. The oxidation and corrosion behaviors of Sn-9Zn-xP solder alloys were determined by means of weight gaining, and secondary ion mass spectrometry was used to analyze the oxygen content. The role and mechanism of P in the solder alloys were also discussed. It is found that the addition of P can significantly improve the wettability of the solder alloys. Incorporating P into Sn-9Zn solder alloy obviously decreases the oxygen content and enhances the oxidation and corrosion resistance. Microstructure observations show that an appropriate amount of P can greatly refine coarse rod-like Zn-rich phases in Sn-9Zn solder alloy.
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