留言板

尊敬的读者、作者、审稿人, 关于本刊的投稿、审稿、编辑和出版的任何问题, 您可以本页添加留言。我们将尽快给您答复。谢谢您的支持!

姓名
邮箱
手机号码
标题
留言内容
验证码
Volume 26 Issue 1
Jan.  2019
数据统计

分享

计量
  • 文章访问数:  435
  • HTML全文浏览量:  65
  • PDF下载量:  10
  • 被引次数: 0
Kai Jiang, Hiroaki Nakano, Satoshi Oue, Tatsuya Morikawa, and Wen-huai Tian, In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions, Int. J. Miner. Metall. Mater., 26(2019), No. 1, pp. 114-123. https://doi.org/10.1007/s12613-019-1715-y
Cite this article as:
Kai Jiang, Hiroaki Nakano, Satoshi Oue, Tatsuya Morikawa, and Wen-huai Tian, In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions, Int. J. Miner. Metall. Mater., 26(2019), No. 1, pp. 114-123. https://doi.org/10.1007/s12613-019-1715-y
引用本文 PDF XML SpringerLink
研究论文

In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions

  • 通讯作者:

    Wen-huai Tian    E-mail: wenhuaitian@ustb.edu.cn

  • The Ni samples were electroformed from additive-free (AF) and saccharin-containing (SC) sulfamate solutions, respectively. In situ backscattered electron (BSE) imaging, electron backscatter diffraction (EBSD), and electron-probe microanalysis (EPMA) were used to investigate the effect of annealing on the deformation behaviors of the AF and SC samples. The results indicate that columnar grains of the as-deposited AF sample had an approximated average width of 3 μm and an approximated aspect ratio of 8. The average width of columnar grains of the as-deposited SC sample was reduced to approximately 400 nm by the addition of saccharin to the electrolyte. A few very-large grains distributed in the matrix of the SC sample after annealing. No direct evidence indicated that S segregated at the grain boundaries before or after annealing. The average value of the total elongations of the SC samples decreased from 16% to 6% after annealing, whereas that of the AF samples increased from 18% to 50%. The dislocation recovery in grain-boundary areas of the annealed AF sample was reduced, which contributed to the appearance of microvoids at the triple junctions. The incompatibility deformation between very-large grains and fine grains contributed to the brittle fracture behavior of the annealed SC Ni.
  • Research Article

    In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions

    + Author Affiliations
    • The Ni samples were electroformed from additive-free (AF) and saccharin-containing (SC) sulfamate solutions, respectively. In situ backscattered electron (BSE) imaging, electron backscatter diffraction (EBSD), and electron-probe microanalysis (EPMA) were used to investigate the effect of annealing on the deformation behaviors of the AF and SC samples. The results indicate that columnar grains of the as-deposited AF sample had an approximated average width of 3 μm and an approximated aspect ratio of 8. The average width of columnar grains of the as-deposited SC sample was reduced to approximately 400 nm by the addition of saccharin to the electrolyte. A few very-large grains distributed in the matrix of the SC sample after annealing. No direct evidence indicated that S segregated at the grain boundaries before or after annealing. The average value of the total elongations of the SC samples decreased from 16% to 6% after annealing, whereas that of the AF samples increased from 18% to 50%. The dislocation recovery in grain-boundary areas of the annealed AF sample was reduced, which contributed to the appearance of microvoids at the triple junctions. The incompatibility deformation between very-large grains and fine grains contributed to the brittle fracture behavior of the annealed SC Ni.
    • loading
    • [1]
      E. Galante, A. Haddad, and N. Marques, Application of explosives in the oil industry, Int. J. Oil Gas Coal Eng., 1(2013), No. 2, p. 16.
      [2]
      G. Birkhoff, D.P. Macdougall, E.M. Pugh, and S.G. Taylor, Explosives with lined cavities, J. Appl. Phys., 19(1948), No. 6, p. 563.
      [3]
      A. Robertson, U. Erb, and G. Palumbo, Practical applications for electrodeposited nanocrystalline materials, Nanostruct. Mater., 12(1999), No. 5, p. 1035.
      [4]
      G.R. Yang, C.P. Huang, W.M. Song, J. Li, J.J. Lu, Y. Ma, and Y. Hao, Microstructure characteristics of Ni/WC composite cladding coatings, Int. J. Miner. Metall. Mater., 23(2016), No. 2, p. 184.
      [5]
      J.X. Wang, G.X. Wang, J.S. Liu, L.Y. Zhang, W. Wang, Z. Li, Q.X. Wang, and J.F. Sun, Microstructure of Ni-Al powder and Ni-Al composite coatings prepared by twin-wire arc spraying, Int. J. Miner. Metall. Mater., 23(2016), No. 7, p. 810.
      [6]
      G.J. Chen, J.M. Gao, M. Zhang, and M. Guo, Efficient and selective recovery of Ni, Cu, and Co from low-nickel matte via a hydrometallurgical process, Int. J. Miner. Metall. Mater., 24(2017), No. 3, p. 249.
      [7]
      M. Prasad and A.H. Chokshi, Superplasticity in electrodeposited nanocrystalline nickel, Acta Mater., 58(2010), No. 17, p. 5724.
      [8]
      M. Prasad and A.H. Chokshi, Extraordinary high strain rate superplasticity in electrodeposited nano-nickel and alloys, Scripta Mater., 63(2010), No. 1, p. 136.
      [9]
      W.H. Yang, Y. Luo, C.Y. Wang, B.G. Wang, and W.T. Tian, High plasticity and anodic behavior of electroformed nickel without chloride ion, Mater. Des., 93(2016), p. 91.
      [10]
      F. Yang, W.T. Tian, C.C. Feng, and B.S. Wang, Crystal defects formed in electroformed nickel liners of shaped charges, Acta Metall. Sin., 22(2009), No. 5, p. 383.
      [11]
      F. Yang, C.H. Li, S.W. Cheng, L. Wang, and W.T. Tian, Deformation behavior of explosive detonation in electroformed nickel liner of shaped charge with nano-sized grains, Trans. Nonferrous Met. Soc. China, 20(2010), No. 8, p. 1397.
      [12]
      F. Yang, W. Tian, H. Nakano, H. Tsuji, S. Oue, and H. Fukushima, Effect of current density and organic additives on the texture and hardness of Ni electrodeposited from sulfamate and Watt's solutions, Mater. Trans., 51(2010), No. 5, p. 948.
      [13]
      H. Nakano, H. Tsuji, S. Oue, H. Fukushima, F. Yang, and W. Tian, Effect of organic additives on the hardness of Ni electrodeposited from sulfamate and Watt's solutions, Mater. Trans., 52(2011), No. 11, p. 2077.
      [14]
      Y.M. Wang, S. Cheng, Q.M. Wei, E. Ma, T.G. Nieh, and A. Hamza, Effects of annealing and impurities on tensile properties of electrodeposited nanocrystalline Ni, Scripta Mater., 51(2004), No. 11, p. 1023.
      [15]
      M. Yamaguchi, M. Shiga, and H. Kaburaki, Grain boundary decohesion by impurity segregation in a nickel-sulfur system, Science, 307(2005), No. 5708, p. 393.
      [16]
      J.K. Heuer, P.R. Okamoto, N.Q. Lam, and J.F. Stubbins, Relationship between segregation-induced intergranular fracture and melting in the nickel-sulfur system, Appl. Phys. Lett., 76(2000), No. 23, p. 3403.
      [17]
      S. Mahalingam, P. Flewitt, and J.F. Knott, The ductile-brittle transition for nominally pure polycrystalline nickel, Mater. Sci. Eng. A, 564(2013), No. 3, p. 342.
      [18]
      C. Kwan, Z. Li, and Z. Wang, Progression of late stage abnormal grain growth of electroformed nanocrystalline Ni without the addition of grain refiner, Metall. Mater. Trans. A, 46(2015), No. 10, p. 4636.
      [19]
      L. Margulies, G. Winther, and H.F. Poulsen, In situ measurement of grain rotation during deformation of polycrystals, Science, 291(2001), No. 5512, p. 2392.
      [20]
      P. Chen, S.C. Mao, Y. Liu, F. Wang, Y.F. Zhang, Z. Zhang, and X.D. Han, In-situ EBSD study of the active slip systems and lattice rotation behavior of surface grains in aluminum alloy during tensile deformation, Mater. Sci. Eng. A, 580(2013), No. 10, p. 114.
      [21]
      S. Zaefferer and N. Elhami, Theory and application of electron channelling contrast imaging under controlled diffraction conditions, Acta Mater., 75(2014), No. 16, p. 20.
      [22]
      I. Gutierrez-Urrutia and D. Raabe, Multistage strain hardening through dislocation substructure and twinning in a high strength and ductile weight-reduced Fe-Mn-Al-C steel, Acta Mater., 60(2012), No. 16, p. 5791.
      [23]
      J.E. Darnbrough and P. Flewitt, Growth of abnormal planar faceted grains in nanocrystalline nickel containing impurity sulphur, Acta Mater., 79(2014), No. 30, p. 421.
      [24]
      P. Cizek, A. Sankaran, E.F. Rauch, and M.R. Barnett, Microstructure and texture of electrodeposited nanocrystalline nickel in the as-deposited state and after in-situ and ex-situ annealing, Metall. Mater. Trans. A, 47(2016), No. 12, p. 6655.
      [25]
      Z.S. You, L. Lu, and K. Lu, Tensile behavior of columnar grained Cu with preferentially oriented nanoscale twins, Acta Mater., 59(2011), No. 18, p. 6927.

    Catalog


    • /

      返回文章
      返回