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Volume 29 Issue 6
Jun.  2022

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Tingting Zhang, Wenxian Wang, Jie Zhang,  and Zhifeng Yan, Interfacial bonding characteristics and mechanical properties of H68/AZ31B clad plate, Int. J. Miner. Metall. Mater., 29(2022), No. 6, pp. 1237-1248. https://doi.org/10.1007/s12613-020-2240-8
Cite this article as:
Tingting Zhang, Wenxian Wang, Jie Zhang,  and Zhifeng Yan, Interfacial bonding characteristics and mechanical properties of H68/AZ31B clad plate, Int. J. Miner. Metall. Mater., 29(2022), No. 6, pp. 1237-1248. https://doi.org/10.1007/s12613-020-2240-8
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研究论文

H68/AZ31B复合板连接界面接合形貌及力学性能

  • 通讯作者:

    张婷婷    E-mail: zhangtingting@tyut.edu.cn

文章亮点

  • (1) 提出采用爆炸焊接方法制备H68/AZ31B复合板。
  • (2) 发现并表征了H68/AZ31B复合板“类波形”连接界面的形成原因及界面微区组织性能。
  • (3) 表征并阐释了爆炸冲击载荷作用下H68/AZ31B复合板近界面微区组织演变特征。
  • 镁/铜合金金属层状复合板兼具镁合金轻质高强和铜合金耐蚀性优及导电性好的特点,属于结构和功能与一体的复合材料。本文提出采用爆炸焊接方法制备H68/AZ31B复合板,并对其连接界面形貌、微观组织形貌特征及界面微区力学性能进行系统表征分析。对界面区组织进行EDS和TEM分析研究发现,其连接界面过渡区有三部分典型特征:1)靠近H68铜合金侧的扩散层组织;2)局部金属熔化的凝固结晶组织,其组织成分包括Cu、CuZn2和α-Mg;3)靠近AZ31B镁合金侧的大塑性变形区;对近界面区的组织进行EBSD分析发现,H68铜合金侧的组织呈现混合孪晶组织的多边形规则晶粒形貌,而靠近AZ31B镁合金侧的组织呈现细小的等轴再结晶晶粒形貌;采用纳米压痕对连接界面过渡区进行测试表征发现,过渡区组织硬度远高于两侧基体的硬度。综合分析发现,爆炸焊接H68/AZ31B复合板连接界面的接合机理可以归纳为两侧基体金属合金的互扩散和界面微区金属局部熔化凝固结晶的冶金结合机理。
  • Research Article

    Interfacial bonding characteristics and mechanical properties of H68/AZ31B clad plate

    + Author Affiliations
    • Interfacial bonding, microstructures, and mechanical properties of an explosively-welded H68/AZ31B clad plate were systematically studied. According to the results, the bonding interface demonstrated a “wavy-like” structure containing three typical zones/layers: (1) diffusion layer adjacent to the H68 brass plate; (2) solidification layer of melted metals at the interface; (3) a layer at the side of AZ31B alloy that experienced severe deformation. Mixed copper, CuZn2, and α-Mg phases were observed in the melted-solidification layer. Regular polygonal grains with twins were found at the H68 alloy side, while fine equiaxed grains were found at the AZ31B alloy side near the interface due to recrystallization. Nanoindentation results revealed the formation of brittle intermetallic CuZn2 phases at the bonding interface. The interface was bonded well through metallurgical reactions due to diffusion of Cu, Zn, and Mg atoms across the interface and metallurgic reaction of partially melted H68 and AZ31B alloys.
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