Cite this article as: |
Xingqun He, Huadong Fu, and Jianxin Xie, Microstructure and properties evolution of in-situ fiber-reinforced Ag–Cu–Ni–Ce alloy during deformation and heat treatment, Int. J. Miner. Metall. Mater., 29(2022), No. 11, pp. 2000-2011. https://doi.org/10.1007/s12613-022-2412-9 |
谢建新 E-mail: jxxie@mater.ustb.edu.cn
[1] |
M. Zhang, W.B. Tian, P.G. Zhang, J.X. Ding, Y.M. Zhang, and Z.M. Sun, Microstructure and properties of Ag–Ti3SiC2 contact materials prepared by pressureless sintering, Int. J. Miner. Metall. Mater., 25(2018), No. 7, p. 810. doi: 10.1007/s12613-018-1629-0
|
[2] |
H.T. Wang, Z.X. Wang, L.Z. Wang, J.Q. Wang, and Y.C. Zhu, Effect of sintering temperature on the physical properties and electrical contact properties of doped AgSnO2 contact materials, Int. J. Miner. Metall. Mater., 25(2018), No. 11, p. 1275. doi: 10.1007/s12613-018-1680-x
|
[3] |
H.Y. Li, X.H. Wang, X.H. Guo, X.H. Yang, and S.H. Liang, Material transfer behavior of AgTiB2 and AgSnO2 electrical contact materials under different currents, Mater. Des., 114(2017), p. 139. doi: 10.1016/j.matdes.2016.10.056
|
[4] |
H. Zhang, X.H. Wang, Y.P. Li, C.S. Guo, and C.M. Zhang, Preparation and characterization of silver-doped graphene-reinforced silver matrix bulk composite as a novel electrical contact material, Appl. Phys. A, 125(2019), No. 2, art. No. 86. doi: 10.1007/s00339-019-2379-1
|
[5] |
K.T. Kloch, P. Kozak, and A. Mlyniec, A review and perspectives on predicting the performance and durability of electrical contacts in automotive applications, Eng. Fail. Anal., 121(2021), art. No. 105143. doi: 10.1016/j.engfailanal.2020.105143
|
[6] |
S. Biyik, F. Arslan, and M. Aydin, Arc-erosion behavior of boric oxide-reinforced silver-based electrical contact materials produced by mechanical alloying, J. Electron. Mater., 44(2015), No. 1, p. 457. doi: 10.1007/s11664-014-3399-4
|
[7] |
T. Aida, K. Uchimura, T. Noguchi, and S. Ogata, Effect of alloying elements on the radio noise characteristics of silver based alloy contacts, [in] 1984 International Symposium on Electromagnetic Compatibility, Tokyo, 1984, p. 1.
|
[8] |
Z. Castro-Dettmer and C. Persad, Performance of a copper-silver alloy as an electromagnetic launcher conductor material, IEEE Trans. Magn., 41(2005), No. 1, p. 176. doi: 10.1109/TMAG.2004.838926
|
[9] |
S. Colombo, P. Battaini, and G. Airoldi, Precipitation kinetics in Ag–7.5 wt.% Cu alloy studied by isothermal DSC and electrical-resistance measurements, J. Alloys Compd., 437(2007), No. 1-2, p. 107. doi: 10.1016/j.jallcom.2006.07.076
|
[10] |
H.K. Zhang, H.Z. Zhao, and Y.H. Zhou, A high-hardness compound in the Ag–Cu–Zr system, Sci. Bull., 31(1986), No. 9, p. 615.
|
[11] |
Z.J. Li, J.J. Tian, S.W. Zhu, J.L. Chen, Q.L. Jin, and M. Xie, The study on microstructure and solidification path of AgCuZnNi brazing alloy, Precious Met., 37(2016), No. 3, p. 6.
|
[12] |
R. Shirakawa, S. Suzuki, A. Matsuda, and N. Shibata, Cd-free silver alloy for sliding contact, [in] Electrical Contacts - 1992 Proceedings of the Thirty-Eighth IEEE Holm Conference on Electrical Contacts, Philadelphia, 1992, p. 119.
|
[13] |
Y.T. Chen, M. Xie, Y.C. Yang, J.M. Zhang, M.M. Liu, S.B. Wang, and Y.F. Yang, Effects of Zn content on the grain growth law of Ag–Cu–Zn alloys, Rare Met. Mater. Eng., 43(2014), No. 1, p. 57. doi: 10.1016/S1875-5372(14)60052-7
|
[14] |
R. Holm, Electric Contacts: Theory and Application, Springer, 1981, p. 109.
|
[15] |
X. Qiao, J. Wang, S.P. Zhou, X.Y. He, J. Li, D.X. Zhuang, and C.G. Jiang, Effect of trace cerium on the electrical contact properties of AgCuNi alloy, Rare Met. Mater. Eng., 37(2008), No. 7, p. 1309.
|
[16] |
M.X. Wei, Q. Liu, Q.Q. Gao, T.M. Zhao, X.Y. Zheng, X.Q. Long, M. Xie, and Y.T. Chen, Study the influence of rare earth elements on microstructure and property of AgCuNi alloy, Precious Met., 40(2019), No. S1, p. 31.
|
[17] |
S.H. Wang, Q.L. Li, W. Liu, and Y.W. Yao, Effect of rare earth on the microstructure of AgCuNi alloys, J. Funct. Mater., V42(2011), p. 799.
|
[18] |
F.X. Huang, M. Li, P. Ying, Y.H. Xu, and Y. Zhang, Effect of trace cerium on the as-cast microstructure of Ag–Cu–Ni alloy, Mater. Sci. Forum, 687(2011), p. 44. doi: 10.4028/www.scientific.net/MSF.687.44
|
[19] |
H,T. Zhang, H.D. Fu, Y.H. Shen, and J.X. Xie, Rapid design of secondary deformation-aging parameters for ultralow Co content Cu–Ni–Co–Si–X alloy via Bayesian optimization machine learning, Int. J. Miner. Metall. Mater., 29(2022), No. 6, p. 1197. doi: 10.1007/s12613-022-2479-3
|
[20] |
X.Q. He, H.D. Fu, H.T. Zhang, J.H. Fang, M. Xie, and J.X. Xie, Machine learning aided rapid discovery of high performance silver alloy electrical contact materials, Acta Metall. Sin., 58(2022), No. 6, p. 816.
|
[21] |
R. Li, X.W. Zuo, and E.G. Wang, Influence of thermomechanical process and Fe addition on microstructural evolution and properties of Cu–26 wt%Ag composite, J. Alloys Compd., 773(2019), p. 121. doi: 10.1016/j.jallcom.2018.09.179
|
[22] |
T. Gu, J.R. Medy, F. Volpi, O. Castelnau, S. Forest, E. Hervé-Luanco, F. Lecouturier, H. Proudhon, P.O. Renault, and L. Thilly, Multiscale modeling of the anisotropic electrical conductivity of architectured and nanostructured Cu–Nb composite wires and experimental comparison, Acta Mater., 141(2017), p. 131. doi: 10.1016/j.actamat.2017.08.066
|
[23] |
C.C. Zhao, R.M. Niu, Y. Xin, D. Brown, D. McGuire, E.G. Wang, and K. Han, Improvement of properties in Cu–Ag composites by doping induced microstructural refinement, Mater. Sci. Eng. A, 799(2021), art. No. 140091. doi: 10.1016/j.msea.2020.140091
|
[24] |
N.D. Stepanov, A.V. Kuznetsov, G.A. Salishchev, N.E. Khlebova, and V.I. Pantsyrny, Evolution of microstructure and mechanical properties in Cu–14%Fe alloy during severe cold rolling, Mater. Sci. Eng. A, 564(2013), p. 264. doi: 10.1016/j.msea.2012.11.121
|
[25] |
L.P. Deng, Z.F. Liu, B.S. Wang, K. Han, and H.L. Xiang, Effects of interface area density and solid solution on the microhardness of Cu–Nb microcomposite wires, Mater. Charact., 150(2019), p. 62. doi: 10.1016/j.matchar.2019.02.002
|
[26] |
L. Zhang and L. Meng, Evolution of microstructure and electrical resistivity of Cu–12wt.%Ag filamentary microcomposite with drawing deformation, Scripta Mater., 52(2005), No. 12, p. 1187. doi: 10.1016/j.scriptamat.2005.03.016
|
[27] |
A. Benghalem and D.G. Morris, Microstructure and strength of wire-drawn Cu–Ag filamentary composites, Acta Mater., 45(1997), No. 1, p. 397. doi: 10.1016/S1359-6454(96)00152-8
|
[28] |
Y. Sakai and H.J. Schneider-Muntau, Ultra-high strength, high conductivity Cu–Ag alloy wires, Acta Mater., 45(1997), No. 3, p. 1017. doi: 10.1016/S1359-6454(96)00248-0
|
[29] |
J.T Hou, Q.L. Hao, L. Zhang, S.J. Zhong, K. Zhu, M. Xie, and W.Q. Qu, Study on the evolution of microstructure and properties during recrystallization of Ag–Cu alloy, Precious Met., 40(2019), Suppl. 1, p. 40.
|
[30] |
S. Sahu, P.C. Yadav, and S. Shekhar, Use of hot rolling for generating low deviation twins and a disconnected random boundary network in inconel 600 alloy, Metall. Mater. Trans. A, 49(2018), No. 2, p. 628. doi: 10.1007/s11661-017-4431-0
|
[31] |
H.F. Zhang, L. Zhou, W.L. Li, G.H. Li, Y.T. Tang, N. Guo, and J.C. Feng, Effect of tool plunge depth on the microstructure and fracture behavior of refill friction stir spot welded AZ91 magnesium alloy joints, Int. J. Miner. Metall. Mater., 28(2021), No. 4, p. 699. doi: 10.1007/s12613-020-2044-x
|
[32] |
G. Frommeyer and G. Wassermann, Microstructure and anomalous mechanical properties of in situ-produced silver-copper composite wires, Acta Metall., 23(1975), No. 11, p. 1353. doi: 10.1016/0001-6160(75)90144-3
|
[33] |
J.D. Embury and R.M. Fisher, The structure and properties of drawn pearlite, Acta Metall., 14(1966), No. 2, p. 147. doi: 10.1016/0001-6160(66)90296-3
|
[34] |
L. Zhang and L. Meng, Effects of drawing strain on formation of filamentary structure and conductivity for Cu–12%Ag alloy, Acta Metall. Sin., 41(2005), No. 3, p. 255.
|
[35] |
V.A. Phillips, Electron microscope observations on moiré fringes and interfacial dislocations at cobalt precipitates in copper, Acta Metall., 14(1966), No. 3, p. 271. doi: 10.1016/0001-6160(66)90084-8
|
[36] |
H. Kazempour-Liasi, M. Tajally, and H. Abdollah-Pour, Liquation cracking in the heat-affected zone of IN939 superalloy tungsten inert gas weldments, Int. J. Miner. Metall. Mater, 27(2020), No. 6, p. 764. doi: 10.1007/s12613-019-1954-y
|
[37] |
S.I. Hong and M.A. Hill, Mechanical stability and electrical conductivity of Cu–Ag filamentary microcomposites, Mater. Sci. Eng. A, 264(1999), No. 1-2, p. 151. doi: 10.1016/S0921-5093(98)01097-1
|
[38] |
S.I. Hong and M.A. Hill, Microstructural stability and mechanical response of Cu–Ag microcomposite wires, Acta Mater., 46(1998), No. 12, p. 4111. doi: 10.1016/S1359-6454(98)00106-2
|
[39] |
K.S. Kumar, H.V. Swygenhoven, and S. Suresh, Mechanical behavior of nanocrystalline metals and alloys, Acta Mater., 51(2003), No. 19, p. 5743. doi: 10.1016/j.actamat.2003.08.032
|
[40] |
A. Misra, J.P. Hirth, and R.G. Hoagland, Length-scale-dependent deformation mechanisms in incoherent metallic multilayered composites, Acta Mater., 53(2005), No. 18, p. 4817. doi: 10.1016/j.actamat.2005.06.025
|
[41] |
J.B. Liu, L. Zhang, and L. Meng, Effects of rare-earth additions on the microstructure and strength of Cu–Ag composites, Mater. Sci. Eng. A, 498(2008), No. 1-2, p. 392. doi: 10.1016/j.msea.2008.08.014
|
[42] |
D.W. Yao and L. Meng, Effects of solute, temperature and strain on the electrical resistivity of Cu–Ag filamentary composites, Phys. B: Condens. Matter, 403(2008), No. 19-20, p. 3384. doi: 10.1016/j.physb.2008.04.038
|
[43] |
J.B. Liu, L. Zhang, A.P. Dong, L.T. Wang, Y.W. Zeng, and L. Meng, Effects of Cr and Zr additions on the microstructure and properties of Cu–6 wt.% Ag alloys, Mater. Sci. Eng. A, 532(2012), p. 331. doi: 10.1016/j.msea.2011.10.099
|
[44] |
W.A. Spitzig, H.L. Downing, F.C. Laabs, E.D. Gibson, and J.D. Verhoeven, Strength and electrical conductivity of a deformation-processed Cu–5 pct Nb composite, Metall. Trans. A, 24(1993), No. 1, p. 7. doi: 10.1007/BF02669596
|