废弃印刷线路板浸出液中原位电沉积制备三维结构Cu<sub>6</sub>Sn<sub>5</sub>/CNTs合金薄膜电极

聂淑晴; 辛玉; 王秋云; 刘程锦; 缪畅; 于利民; 肖围

doi:10.1007/s12613-022-2591-4

Volume 30 Issue 6

Jun. 2023

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文章导航 > 矿物冶金与材料学报（英文） > 2023 > 30(6): 1171-1180

Shuqing Nie, Yu Xin, Qiuyun Wang, Chengjin Liu, Chang Miao, Limin Yu, and Wei Xiao, Three-dimensional structural Cu₆Sn₅/carbon nanotubes alloy thin-film electrodes fabricated by in situ electrodeposition from the leaching solution of waste-printed circuit boards, Int. J. Miner. Metall. Mater., 30(2023), No. 6, pp. 1171-1180. https://doi.org/10.1007/s12613-022-2591-4

Cite this article as:

Shuqing Nie, Yu Xin, Qiuyun Wang, Chengjin Liu, Chang Miao, Limin Yu, and Wei Xiao, Three-dimensional structural Cu6Sn5/carbon nanotubes alloy thin-film electrodes fabricated by in situ electrodeposition from the leaching solution of waste-printed circuit boards, Int. J. Miner. Metall. Mater., 30(2023), No. 6, pp. 1171-1180. https://doi.org/10.1007/s12613-022-2591-4

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研究论文

废弃印刷线路板浸出液中原位电沉积制备三维结构Cu₆Sn₅/CNTs合金薄膜电极

长江大学化学与环境工程学院, 湖北, 荆州 434023

通讯作者:
肖围 E-mail: xwylyq2006@126.com

文章亮点

(1) 原位电沉积法制备了三维结构Cu₆Sn₅/CNTs薄膜电极。

(2) 研究了电沉积液中碳纳米管的浓度对合金薄膜电极性能的影响。

(3) 碳纳米管的三维网状结构可以很好地分散Cu₆Sn₅合金纳米颗粒。

中文摘要

锡基材料因具有较高的理论容量而被认为是极具吸引力的锂离子电池负极材料。然而，由于合金化和去合金化过程中存在体积膨胀效应，使得电池容量迅速衰减，限制了其实际应用。本文采用废弃印刷线路板（WPCBs）浸出液作为电沉积液，通过原位电沉积法制备无粘结剂的铜锡合金/碳纳米管（Cu₆Sn₅/CNTs）合金薄膜电极，并探究了电沉积液中碳纳米管（CNTs）浓度对合金薄膜电极的影响。实验结果表明，当电沉积液中CNTs浓度为0.2 g·L⁻¹时，易团聚的Cu₆Sn₅合金纳米颗粒均匀分布在CNTs形成的三维网状结构中，这使得Cu₆Sn₅/CNTs-0.2合金薄膜电极组装的电池表现出优异的循环性能和倍率性能，在100 mA·g⁻¹的电流密度下循环50次后，放电比容量为458.35 mAh·g⁻¹，容量保持率为82.58%；在0.1、0.2、0.5、1.0和2.0 A·g⁻¹的电流密度下放电比容量分别为518.24、445.52、418.18、345.33和278.05 mAh·g⁻¹。该研究不仅为锂离子电池负极材料的制备提供了参考，还为资源化利用废弃印刷线路板提供了一种经济有效的策略。

关键词:

Research Article

Three-dimensional structural Cu₆Sn₅/carbon nanotubes alloy thin-film electrodes fabricated by in situ electrodeposition from the leaching solution of waste-printed circuit boards

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Abstract

Abstract

Tin-based materials are very attractive anodes because of their high theoretical capacity, but their rapid capacity fading from volume expansions limits their practical applications during alloying and dealloying processes. Herein, the improved binder-free tin-copper intermetallic/carbon nanotubes (Cu₆Sn₅/CNTs) alloy thin-film electrodes are directly fabricated through efficient in situ electrodeposition from the leaching solution of treated waste-printed circuit boards (WPCBs). The characterization results show that the easily agglomerated Cu₆Sn₅ alloy nanoparticles are uniformly dispersed across the three-dimensional network when the CNTs concentration in the electrodeposition solution is maintained at 0.2 g·L⁻¹. Moreover, the optimal Cu₆Sn₅/CNTs-0.2 alloy thin-film electrode can not only provide a decent discharge specific capacity of 458.35 mAh·g⁻¹ after 50 cycles at 100 mA·g⁻¹ within capacity retention of 82.58% but also deliver a relatively high reversible specific capacity of 518.24, 445.52, 418.18, 345.33, and 278.05 mAh·g⁻¹ at step-increased current density of 0.1, 0.2, 0.5, 1.0, and 2.0 A·g⁻¹, respectively. Therefore, the preparation process of the Cu₆Sn₅/CNTs-0.2 alloy thin-film electrode with improved electrochemical performance may provide a cost-effective strategy for the resource utilization of WPCBs to fabricate anode materials for lithium-ion batteries.
- tin-copper intermetallic;
- in situ electrodeposition;
- carbon nanotubes;
- anode material;
- lithium-ion battery

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废弃印刷线路板浸出液中原位电沉积制备三维结构Cu₆Sn₅/CNTs合金薄膜电极

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Three-dimensional structural Cu₆Sn₅/carbon nanotubes alloy thin-film electrodes fabricated by in situ electrodeposition from the leaching solution of waste-printed circuit boards

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废弃印刷线路板浸出液中原位电沉积制备三维结构Cu6Sn5/CNTs合金薄膜电极

文章亮点

中文摘要

Three-dimensional structural Cu6Sn5/carbon nanotubes alloy thin-film electrodes fabricated by in situ electrodeposition from the leaching solution of waste-printed circuit boards

Abstract

References

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Catalog

废弃印刷线路板浸出液中原位电沉积制备三维结构Cu₆Sn₅/CNTs合金薄膜电极

Three-dimensional structural Cu₆Sn₅/carbon nanotubes alloy thin-film electrodes fabricated by in situ electrodeposition from the leaching solution of waste-printed circuit boards