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Volume 31 Issue 11
Nov.  2024
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文章导航 >  矿物冶金与材料学报（英文）  > 2024  >  31(11): 2488-2497
Yuntian Lou, Weiwei Chang, Yu Zhang, Shengyu He, Xudong Chen, Hongchang Qian,  and Dawei Zhang, Microbiologically influenced corrosion resistance enhancement of copper-containing high entropy alloy FexCu(1−x)CoNiCrMn against Pseudomonas aeruginosa, Int. J. Miner. Metall. Mater., 31(2024), No. 11, pp. 2488-2497. https://doi.org/10.1007/s12613-024-2932-6
Cite this article as:
Yuntian Lou, Weiwei Chang, Yu Zhang, Shengyu He, Xudong Chen, Hongchang Qian,  and Dawei Zhang, Microbiologically influenced corrosion resistance enhancement of copper-containing high entropy alloy FexCu(1−x)CoNiCrMn against Pseudomonas aeruginosa, Int. J. Miner. Metall. Mater., 31(2024), No. 11, pp. 2488-2497. https://doi.org/10.1007/s12613-024-2932-6
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研究论文

含铜高熵合金FexCu(1−x)CoNiCrMn对铜绿假单胞菌诱导的微生物腐蚀抗性增强

  • 1)

    北京科技大学新材料技术研究院, 北京 100083, 中国

  • 2)

    北京科技大学国家材料腐蚀与防护数据中心, 北京 100083, 中国

  • 3)

    北京科技大学顺德创新学院, 佛山 528399, 中国

  • 4)

    佛山大学材料与能源学院, 佛山 528000, 中国


    • * 共同第一作者
  • 通讯作者:

    张达威    E-mail: dzhang@ustb.edu.cn

文章亮点

  • (1) 发现在FexCu(1−x)CoNiCrMn中铜含量超过5%晶粒尺寸显著增大。
  • (2) 铜含量的持续增加会导致FexCu(1−x)CoNiCrMn表面钝化能力下降。
  • (3) 筛选出兼具耐蚀性、抗菌性的耐微生物腐蚀Fe0.75Cu0.25CoNiCrMn高熵合金。
  • 由于合金元素的多样性和复杂性，高熵合金往往在特定的腐蚀环境下表现出优异的耐蚀性，因此被认为是极具潜力的腐蚀研究对象。本文旨在提高FeCoNiCrMn高熵合金（HEAs）的耐微生物腐蚀（MIC）能力，制备了一系列FexCu(1−x)CoNiCrMn（x = 1、0.75、0.5 和 0.25）的HEAs试样，并研究了它们在典型腐蚀性微生物——铜绿假单胞菌（Pseudomonas aeruginosa）培养基中的微观结构特征、腐蚀行为（包括形貌观察和电化学性能）以及抗菌性能。研究目的是筛选出最优铜含量的FexCu(1−x)CoNiCrMn，使之兼顾耐腐蚀性和抗菌性能。结果表明，所有FexCu(1−x)CoNiCrMn试样均表现为FCC相，且Fe0.75Cu0.25CoNiCrMn试样的晶粒细化效果显著。电化学测试结果显示，与无菌条件相比，Fe0.75Cu0.25CoNiCrMn在接种了铜绿假单胞菌的培养基中具有较低的腐蚀电流密度（icorr）和点蚀电位（Epit），表现出良好的耐MIC性能。抑菌试验结果显示，经过14天的浸泡，Fe0.75Cu0.25CoNiCrMnn的抑菌率达到89.5%，有效抑制了铜绿假单胞菌的附着和生物膜的形成，同时表现出对MIC的耐受性。
    • Research Article

    Microbiologically influenced corrosion resistance enhancement of copper-containing high entropy alloy FexCu(1−x)CoNiCrMn against Pseudomonas aeruginosa

    + Author Affiliations
      Abstract
    • To enhance the microbiologically influenced corrosion (MIC) resistance of FeCoNiCrMn high entropy alloy (HEAs), a series of FexCu(1−x)CoNiCrMn (x = 1, 0.75, 0.5, and 0.25) HEAs were prepared. Microstructural characteristics, corrosion behavior (morphology observation and electrochemical properties), and antimicrobial performance of FexCu(1−x)CoNiCrMn HEAs were evaluated in a medium inoculated with typical corrosive microorganism Pseudomonas aeruginosa. The aim was to identify copper-containing FeCoNiCrMn HEAs that balance corrosion resistance and antimicrobial properties. Results revealed that all FexCu(1−x)CoNiCrMn (x = 1, 0.75, 0.5, and 0.25) HEAs exhibited an FCC (face centered cubic) phase, with significant grain refinement observed in Fe0.75Cu0.25CoNiCrMn HEA. Electrochemical tests indicated that Fe0.75Cu0.25CoNiCrMn HEA demonstrated lower corrosion current density (icorr) and pitting potential (Epit) compared to other FexCu(1−x)CoNiCrMn HEAs in P. aeruginosa-inoculated medium, exhibiting superior resistance to MIC. Anti-microbial tests showed that after 14 d of immersion, Fe0.75Cu0.25CoNiCrMn achieved an antibacterial rate of 89.5%, effectively inhibiting the adhesion and biofilm formation of P. aeruginosa, thereby achieving resistance to MIC.
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