留言板

尊敬的读者、作者、审稿人, 关于本刊的投稿、审稿、编辑和出版的任何问题, 您可以本页添加留言。我们将尽快给您答复。谢谢您的支持!

姓名
邮箱
手机号码
标题
留言内容
验证码
数据统计

分享

计量
  • 文章访问数:  211
  • HTML全文浏览量:  94
  • PDF下载量:  20
  • 被引次数: 0
Jinyu Liang, Guoliang Xie, Feixiang Liu, Wenli Xue, Rui Wang,  and Xinhua Liu, Optimizing the comprehensive performance of Cu-Ni-Si alloys via controlling nanometer-lamellar discontinuous precipitation structure, Int. J. Miner. Metall. Mater.,(2024). https://doi.org/10.1007/s12613-024-2969-6
Cite this article as:
Jinyu Liang, Guoliang Xie, Feixiang Liu, Wenli Xue, Rui Wang,  and Xinhua Liu, Optimizing the comprehensive performance of Cu-Ni-Si alloys via controlling nanometer-lamellar discontinuous precipitation structure, Int. J. Miner. Metall. Mater.,(2024). https://doi.org/10.1007/s12613-024-2969-6
引用本文 PDF XML SpringerLink
  • Research Article

    Optimizing the comprehensive performance of Cu-Ni-Si alloys via controlling nanometer-lamellar discontinuous precipitation structure

    + Author Affiliations
    • Simultaneously achieving high strength and high conductivity in Cu-Ni-Si alloys poses a significant challenge, which greatly constrains its applications in the electronics industry. This paper offers a new pathway for the improvement of properties, by preparation of nanometer lamellar discontinuous precipitates (DPs) arranged with the approximate same direction through a combination of deformation-aging and cold rolling process. The strengthening effect is mainly attributed to nanometer-lamellar DPs strengthening and dislocation strengthening mechanism. The accumulation of dislocations at the interface between nanometer lamellar DPs and matrix during cold deformation process can results in the decrease of dislocation density inside the matrix grains, leading to the acceptably slight reduction of electrical conductivity during cold rolling. The alloy exhibits an electrical conductivity of 45.32 %IACS, a tensile strength of 882.67 MPa, and a yield strength of 811.33 MPa by this method. This study can provide a guidance for the composition and microstructure design of Cu-Ni-Si alloy in the future, by controlling the morphology and distribution of DPs.

    • loading

    Catalog


    • /

      返回文章
      返回