Yong-nan Chen, Gang Liu, Xue-min Zhang, and Yong-qing Zhao, Influence of semisolid forging ratio on the microstructure and mechanical properties of Ti14 alloy, Int. J. Miner. Metall. Mater., 20(2013), No. 3, pp. 266-272. https://doi.org/10.1007/s12613-013-0722-7
Cite this article as:
Yong-nan Chen, Gang Liu, Xue-min Zhang, and Yong-qing Zhao, Influence of semisolid forging ratio on the microstructure and mechanical properties of Ti14 alloy, Int. J. Miner. Metall. Mater., 20(2013), No. 3, pp. 266-272. https://doi.org/10.1007/s12613-013-0722-7

Influence of semisolid forging ratio on the microstructure and mechanical properties of Ti14 alloy

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  • Corresponding author:

    Yong-nan Chen    E-mail: frank_cyn@163.com

  • Received: 19 April 2012Revised: 24 June 2012Accepted: 26 June 2012
  • The present work is focused on the microstructure and mechanical properties of Ti14 alloy with different semisolid deformation ratios during forging tests. The results revealed that the forging ratio had a significant effect on the precipitation of the alloy. Fewer plate-shaped Ti2Cu tended to precipitate on grain boundaries with higher forging ratios, and finally the plate-shaped Ti2Cu formed precipitate-free zones along grain boundaries with a forging ratio of 75%. The precipitation on grain boundaries was found to be controlled by a peritectic reaction. Large forging ratios accelerated the extrusion of liquid and resulted in less liquid along the prior grain boundaries, which reduced the peritectic precipitation in this region and formed precipitate-free zones during re-solidification. In addition, increasing the forging ratio could accelerate dynamic recrystallization, which is favorable for improving the semisolid formability. The tensile ductility increased with increasing forging ratio, and a mixed fracture mode, involving both cleavage and dimple fracture, was observed after forging with a forging ratio of 75%, which is attributed to the presence of precipitate-free zones formed along grain boundaries during semisolid processing.
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