Zhi-yuan Ma, Hong-ying Yang, Song-tao Huang, Yang Lü, and Liu Xiong, Ultra fast microwave-assisted leaching for the recovery of copper and tellurium from copper anode slime, Int. J. Miner. Metall. Mater., 22(2015), No. 6, pp. 582-588. https://doi.org/10.1007/s12613-015-1110-2
Cite this article as:
Zhi-yuan Ma, Hong-ying Yang, Song-tao Huang, Yang Lü, and Liu Xiong, Ultra fast microwave-assisted leaching for the recovery of copper and tellurium from copper anode slime, Int. J. Miner. Metall. Mater., 22(2015), No. 6, pp. 582-588. https://doi.org/10.1007/s12613-015-1110-2
Zhi-yuan Ma, Hong-ying Yang, Song-tao Huang, Yang Lü, and Liu Xiong, Ultra fast microwave-assisted leaching for the recovery of copper and tellurium from copper anode slime, Int. J. Miner. Metall. Mater., 22(2015), No. 6, pp. 582-588. https://doi.org/10.1007/s12613-015-1110-2
Citation:
Zhi-yuan Ma, Hong-ying Yang, Song-tao Huang, Yang Lü, and Liu Xiong, Ultra fast microwave-assisted leaching for the recovery of copper and tellurium from copper anode slime, Int. J. Miner. Metall. Mater., 22(2015), No. 6, pp. 582-588. https://doi.org/10.1007/s12613-015-1110-2
The decomposition of copper anode slime heated by microwave energy in a sulfuric acid medium was investigated. Leaching experiments were carried out in a multi-mode cavity with microwave assistance. The leaching process parameters were optimized using response surface methodology (RSM). Under the optimized conditions, the leaching efficiencies of copper and tellurium were 99.56% ±0.16% and 98.68% ±0.12%, respectively. Meanwhile, a conventional leaching experiment was performed in order to evaluate the influence of microwave radiation. The mechanism of microwave-assisted leaching of copper anode slime was also investigated. In the results, the microwave technology is demonstrated to have a great potential to improve the leaching efficiency and reduce the leaching time. The enhanced recoveries of copper and tellurium are believed to result from the presence of a temperature gradient due to the shallow microwave penetration depth and the superheating at the solid-liquid interface.