Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

Hui Xu; Jian-hao Chen; Shu-bin Ren; Xin-bo He; Xuan-hui Qu

doi:10.1007/s12613-018-1592-9

Volume 25 Issue 4

Apr. 2018

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Article Navigation > International Journal of Minerals, Metallurgy and Materials > 2018 > 25(4): 459-471

Hui Xu, Jian-hao Chen, Shu-bin Ren, Xin-bo He, and Xuan-hui Qu, Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering, Int. J. Miner. Metall. Mater., 25(2018), No. 4, pp. 459-471. https://doi.org/10.1007/s12613-018-1592-9

Cite this article as:

Hui Xu, Jian-hao Chen, Shu-bin Ren, Xin-bo He, and Xuan-hui Qu, Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering, Int. J. Miner. Metall. Mater., 25(2018), No. 4, pp. 459-471. https://doi.org/10.1007/s12613-018-1592-9

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Research Article

Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

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Corresponding author:
Shu-bin Ren E-mail: sbren@ustb.edu.cn
Received: 7 December 2017; Revised: 15 January 2018; Accepted: 16 January 2018

Abstract

Abstract

Nickel-coated graphite flakes/copper (GN/Cu) composites were fabricated by spark plasma sintering with the surface of graphite flakes (GFs) being modified by Ni-P electroless plating. The effects of the phase transition of the amorphous Ni-P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity (TC) of the GN/Cu composites were systematically investigated. The introduction of Ni-P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X-Y basal plane of the GF/Cu composites with 20vol%-30vol% graphite flakes. However, when the graphite flake content was greater than 30vol%, the TC of the GF/Cu composites decreased with the introduction of Ni-P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.
- copper matrix composites;
- graphite flake;
- nickel-phosphorus transition layer;
- sintering behavior;
- thermal conductivity

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