<i>In situ</i> backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions

Kai Jiang; Hiroaki Nakano; Satoshi Oue; Tatsuya Morikawa; Wen-huai Tian

doi:10.1007/s12613-019-1715-y

Volume 26 Issue 1

Jan. 2019

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Article Navigation > International Journal of Minerals, Metallurgy and Materials > 2019 > 26(1): 114-123

Kai Jiang, Hiroaki Nakano, Satoshi Oue, Tatsuya Morikawa, and Wen-huai Tian, In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions, Int. J. Miner. Metall. Mater., 26(2019), No. 1, pp. 114-123. https://doi.org/10.1007/s12613-019-1715-y

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Kai Jiang, Hiroaki Nakano, Satoshi Oue, Tatsuya Morikawa, and Wen-huai Tian, In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions, Int. J. Miner. Metall. Mater., 26(2019), No. 1, pp. 114-123. https://doi.org/10.1007/s12613-019-1715-y

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Research Article

In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions

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Corresponding author:
Wen-huai Tian E-mail: wenhuaitian@ustb.edu.cn
Received: 27 April 2018; Revised: 23 August 2018; Accepted: 16 October 2018

Abstract

Abstract

The Ni samples were electroformed from additive-free (AF) and saccharin-containing (SC) sulfamate solutions, respectively. In situ backscattered electron (BSE) imaging, electron backscatter diffraction (EBSD), and electron-probe microanalysis (EPMA) were used to investigate the effect of annealing on the deformation behaviors of the AF and SC samples. The results indicate that columnar grains of the as-deposited AF sample had an approximated average width of 3 μm and an approximated aspect ratio of 8. The average width of columnar grains of the as-deposited SC sample was reduced to approximately 400 nm by the addition of saccharin to the electrolyte. A few very-large grains distributed in the matrix of the SC sample after annealing. No direct evidence indicated that S segregated at the grain boundaries before or after annealing. The average value of the total elongations of the SC samples decreased from 16% to 6% after annealing, whereas that of the AF samples increased from 18% to 50%. The dislocation recovery in grain-boundary areas of the annealed AF sample was reduced, which contributed to the appearance of microvoids at the triple junctions. The incompatibility deformation between very-large grains and fine grains contributed to the brittle fracture behavior of the annealed SC Ni.
- backscattered electron imaging;
- annealing;
- electroformed Ni;
- sulfamate solution;
- deformation behaviors

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