C. D. Gómez-Esparza, R. Peréz-Bustamante, J. M. Alvarado-Orozco, J. Muñoz-Saldaña, R. Martínez-Sánchez, J. M. Olivares-Ramírez, and A. Duarte-Moller, Microstructural evaluation and nanohardness of an AlCoCuCrFeNiTi high-entropy alloy, Int. J. Miner. Metall. Mater., 26(2019), No. 5, pp. 634-641. https://doi.org/10.1007/s12613-019-1771-3
Cite this article as:
C. D. Gómez-Esparza, R. Peréz-Bustamante, J. M. Alvarado-Orozco, J. Muñoz-Saldaña, R. Martínez-Sánchez, J. M. Olivares-Ramírez, and A. Duarte-Moller, Microstructural evaluation and nanohardness of an AlCoCuCrFeNiTi high-entropy alloy, Int. J. Miner. Metall. Mater., 26(2019), No. 5, pp. 634-641. https://doi.org/10.1007/s12613-019-1771-3
Research Article

Microstructural evaluation and nanohardness of an AlCoCuCrFeNiTi high-entropy alloy

+ Author Affiliations
  • Corresponding author:

    C. D. Gómez-Esparza    E-mail: cynthia.gomez@cimav.edu.mx

  • Received: 6 July 2018Revised: 1 December 2018Accepted: 2 December 2018
  • An AlCoCuCrFeNiTi high-entropy alloy (HEA) was prepared by mechanical alloying and sintering to study the effect of Ti addition to the widely studied AlCoCuCrFeNi system. The structural and microstructural characteristics were investigated by X-ray diffraction (XRD), scanning electron microscopy (SEM), and transmission electron microscopy (TEM). The formation of four micrometric phases was detected:a Cu-rich phase with a face-centered cubic (fcc) structure, a body-centered cubic (bcc) solid solution with Cu-rich plate-like precipitates (fcc), an ordered bcc phase, and a tetragonal structure. The XRD patterns corroborate the presence of a mixture of bcc-, fcc-, and tetragonal-structured phases. The Vickers hardness of the alloy under study was more than twice that of the AlCoCuCrFeNi alloy. Nanoindentation tests were performed to evaluate the mechanical response of the individual phases to elucidate the relationship between chemical composition, crystal structure, and mechanical performance of the multiphase microstructure of the AlCoCuCrFeNiTi HEA.
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