Tian-xing Lu, Cun-guang Chen, Zhi-meng Guo, Pei Li, and Ming-xing Guo, Tungsten nanoparticle-strengthened copper composite prepared by a sol-gel method and in-situ reaction, Int. J. Miner. Metall. Mater., 26(2019), No. 11, pp. 1477-1484. https://doi.org/10.1007/s12613-019-1889-3
Cite this article as:
Tian-xing Lu, Cun-guang Chen, Zhi-meng Guo, Pei Li, and Ming-xing Guo, Tungsten nanoparticle-strengthened copper composite prepared by a sol-gel method and in-situ reaction, Int. J. Miner. Metall. Mater., 26(2019), No. 11, pp. 1477-1484. https://doi.org/10.1007/s12613-019-1889-3
Research Article

Tungsten nanoparticle-strengthened copper composite prepared by a sol-gel method and in-situ reaction

+ Author Affiliations
  • Corresponding authors:

    Cun-guang Chen    E-mail: cgchen@ustb.edu.cn

    Zhi-meng Guo    E-mail: zmguo@ustb.edu.cn

  • Received: 28 June 2019Revised: 22 August 2019Accepted: 30 August 2019
  • Tungsten nanoparticle-strengthened Cu composites were prepared from nanopowder synthesized by a sol-gel method and in-situ hydrogen reduction. The tungsten particles in the Cu matrix were well-dispersed with an average size of approximately 100-200 nm. The addition of nanosized W particles remarkably improves the mechanical properties, while the electrical conductivity did not substantially decrease. The Cu-W composite with 6wt% W has the most comprehensive properties with an ultimate strength of 310 MPa, yield strength of 238 MPa, hardness of HV 108 and electrical conductivity of 90% IACS. The enhanced mechanical property and only a small loss of electrical conductivity demonstrate the potential of this new strategy to prepare W nanoparticle-strengthened Cu composites.
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