Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface

Xiaoyan Liu; Fangyuan Sun; Wei Wang; Jie Zhao; Luhua Wang; Zhanxun Che; Guangzhu Bai; Xitao Wang; Jinguo Wang; Moon J. Kim; Hailong Zhang

doi:10.1007/s12613-021-2336-9

Volume 29 Issue 11

Nov. 2022

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Article Navigation > International Journal of Minerals, Metallurgy and Materials > 2022 > 29(11): 2020-2031

Xiaoyan Liu, Fangyuan Sun, Wei Wang, Jie Zhao, Luhua Wang, Zhanxun Che, Guangzhu Bai, Xitao Wang, Jinguo Wang, Moon J. Kim, and Hailong Zhang, Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface, Int. J. Miner. Metall. Mater., 29(2022), No. 11, pp. 2020-2031. https://doi.org/10.1007/s12613-021-2336-9

Cite this article as:

Xiaoyan Liu, Fangyuan Sun, Wei Wang, Jie Zhao, Luhua Wang, Zhanxun Che, Guangzhu Bai, Xitao Wang, Jinguo Wang, Moon J. Kim, and Hailong Zhang, Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface, Int. J. Miner. Metall. Mater., 29(2022), No. 11, pp. 2020-2031. https://doi.org/10.1007/s12613-021-2336-9

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Research Article

Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface

+ Author Affiliations

1)
State Key Laboratory for Advanced Metals and Materials, University of Science and Technology Beijing, Beijing 100083, China
2)
School of Energy and Environmental Engineering, University of Science and Technology Beijing, Beijing 100083, China
3)
Beijing Institute of Structure and Environment Engineering, Beijing 100076, China
4)
Department of Materials Science and Engineering, University of Texas at Dallas, Richardson, TX 75080, USA
5)
Institute of Engineering Thermophysics, Chinese Academy of Sciences, Beijing 100190, China
6)
Shandong Provincial Key Laboratory for High Strength Lightweight Metallic Materials, Advanced Materials Institute, Qilu University of Technology (Shandong Academy of Sciences), Jinan 250014, China
7)
Collaborative Innovation Center of Steel Technology, University of Science and Technology Beijing, Beijing 100083, China

Corresponding authors:
Fangyuan Sun E-mail: sunfangyuan@ustb.edu.cn

Hailong Zhang E-mail: hlzhang@ustb.edu.cn
Received: 17 April 2021; Revised: 13 July 2021; Accepted: 28 July 2021; Available online: 29 July 2021

Abstract

Abstract

The thermal conductivity of diamond particles reinforced copper matrix composite as an attractive thermal management material is significantly lowered by the non-wetting heterointerface. The paper investigates the heat transport behavior between a 200-nm Cu layer and a single-crystalline diamond substrate inserted by a chromium (Cr) interlayer having a series of thicknesses from 150 nm down to 5 nm. The purpose is to detect the impact of the modifying interlayer thickness on the interfacial thermal conductance (h) between Cu and diamond. The time-domain thermoreﬂectance measurements suggest that the introduction of Cr interlayer dramatically improves the h between Cu and diamond owing to the enhanced interfacial adhesion and bridged dissimilar phonon states between Cu and diamond. The h value exhibits a decreasing trend as the Cr interlayer becomes thicker because of the increase in thermal resistance of Cr interlayer. The high h values are observed for the Cr interlayer thicknesses below 21 nm since phononic transport channel dominates the thermal conduction in the ultrathin Cr layer. The findings provide a way to tune the thermal conduction across the metal/nonmetal heterogeneous interface, which plays a pivotal role in designing materials and devices for thermal management applications.
- sputtering;
- diamond;
- metal/nonmetal interface;
- interfacial thermal conductance;
- time-domain thermoreflectance

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