Cite this article as: |
Jiaqiang Li, Hongtao Zhang, Jingtai Sun, Huadong Fu, and Jianxin Xie, Design of low-alloying and high-performance solid solution-strengthened copper alloys with element substitution for sustainable development, Int. J. Miner. Metall. Mater., 31(2024), No. 5, pp. 826-832. https://doi.org/10.1007/s12613-024-2870-3 |
Hongtao Zhang E-mail: zht@ustb.edu.cn
Jianxin Xie E-mail: jxxie@mater.ustb.edu.cn
[1] |
Y.X. Jiang, H.F. Lou, H.F. Xie, et al., Development status and prospects of advanced copper alloy, Strategic Study of CAE, 22(2020), No. 5, p. 84. doi: 10.15302/J-SSCAE-2020.05.015
|
[2] |
C.Z. Huang, Y.B. Jiang, Z.X. Wu, et al., Significantly enhanced high-temperature mechanical properties of Cu–Cr–Zn–Zr–Si alloy with stable second phases and grain boundaries, Mater. Des., 233(2023), art. No. 112292. doi: 10.1016/j.matdes.2023.112292
|
[3] |
K. Maki, Y. Ito, H. Matsunaga, and H. Mori, Solid-solution copper alloys with high strength and high electrical conductivity, Scripta Mater., 68(2013), No. 10, p. 777. doi: 10.1016/j.scriptamat.2012.12.027
|
[4] |
J.R. Davis, ASM Specialty Handbook : Copper and Copper Alloys, ASM International, Ohio, 2001.
|
[5] |
H. Zhang, X.C. Deng, and G.H. Zhang, Preparation and properties of multiphase solid-solution strengthened high-performance W–Cu alloys through alloying with Mo, Fe and Ni, Mater. Sci. Eng. A, 871(2023), art. No. 144909. doi: 10.1016/j.msea.2023.144909
|
[6] |
S.W. Huang, P.F. Zhou, F.X. Luo, et al., Effects of Ni and Mn contents on precipitation and strengthening behavior in Cu–Ni–Mn ternary alloys, Mater. Charact., 199(2023), art. No. 112775. doi: 10.1016/j.matchar.2023.112775
|
[7] |
J.Y. Wang, X.Q. Lü, S.Q. Chen, Y. Gao, and Y. Liu, Effect of Ni content on the solid solution strengthening behavior of Cu–Ni–Ag alloys, Mater. Sci. Eng. Powder Metall., 26(2021), No. 3, p. 263.
|
[8] |
R.W. Liao, L.R. Wang, X.Z. Liu, and Y. Liu, Microstructure and properties of Cu–Zn–Al–Fe alloy, Hot Working Technol., 48(2019), No. 16. p. 75.
|
[9] |
P. Yang, D.Y. He, W. Shao, et al., Study of the microstructure and mechanical properties of Cu–Sn alloys formed by selective laser melting with different Sn contents, J. Mater. Res. Technol., 24(2023), p. 5476. doi: 10.1016/j.jmrt.2023.04.198
|
[10] |
E. Bruder, P. Braun, H.U. Rehman, et al., Influence of solute effects on the saturation grain size and rate sensitivity in Cu–X alloys, Scripta Mater., 144(2018), p. 5. doi: 10.1016/j.scriptamat.2017.09.031
|
[11] |
E.A. Olivetti and J.M. Cullen, Toward a sustainable materials system, Science, 360(2018), No. 6396, p. 1396. doi: 10.1126/science.aat6821
|
[12] |
D. Raabe, C.C. Tasan, and E.A. Olivetti, Strategies for improving the sustainability of structural metals, Nature, 575(2019), p. 64. doi: 10.1038/s41586-019-1702-5
|
[13] |
X.Y. Li and K. Lu, Playing with defects in metals, Nat. Mater., 16(2017), No. 7, p. 700. doi: 10.1038/nmat4929
|
[14] |
X.Y. Li and K. Lu, Improving sustainability with simpler alloys, Science, 364(2019), No. 6442, p. 733. doi: 10.1126/science.aaw9905
|
[15] |
H.T. Zhang, H.D. Fu, X.Q. He, et al., Dramatically enhanced combination of ultimate tensile strength and electric conductivity of alloys via machine learning screening, Acta Mater., 200(2020), p. 803. doi: 10.1016/j.actamat.2020.09.068
|
[16] |
S.S. Zhang, H.H. Zhu, L. Zhang, W.Q. Zhang, H.Q. Yang, and X.Y. Zeng, Microstructure and properties in QCr0.8 alloy produced by selective laser melting with different heat treatment, J. Alloys Compd., 800(2019), p. 286. doi: 10.1016/j.jallcom.2019.06.018
|
[17] |
X.W. Zuo, K. Han, C.C. Zhao, R.M. Niu, and E.G. Wang, Microstructure and properties of nanostructured Cu28wt%Ag microcomposite deformed after solidifying under a high magnetic field, Mater. Sci. Eng. A, 619(2014), p. 319. doi: 10.1016/j.msea.2014.09.070
|
[18] |
T.P. Harzer, S. Djaziri, R. Raghavan, and G. Dehm, Nanostructure and mechanical behavior of metastable Cu–Cr thin films grown by molecular beam epitaxy, Acta Mater., 83(2015), p. 318. doi: 10.1016/j.actamat.2014.10.013
|
[19] |
A. Akhtar and E. Teghtsoonian, Substitutional solution hardening of magnesium single crystals, Philos. Mag., 25(1972), No. 4, p. 897. doi: 10.1080/14786437208229311
|
[20] |
J.Z. Li, H. Ding, B.M. Li, W.L. Gao, J. Bai, and G. Sha, Effect of Cr and Sn additions on microstructure, mechanical-electrical properties and softening resistance of Cu–Cr–Sn alloy, Mater. Sci. Eng. A, 802(2021), art. No. 140628. doi: 10.1016/j.msea.2020.140628
|
[21] |
H.E. Friedrich and B.L. Mordike, Magnesium technology, Springer-Verlag Berlin Heidelberg, Berlin, 2006.
|
[22] |
L. Balogh, T. Ungár, Y.H. Zhao, et al., Influence of stacking-fault energy on microstructural characteristics of ultrafine-grain copper and copper–zinc alloys, Acta Mater., 56(2008), No. 4, p. 809. doi: 10.1016/j.actamat.2007.10.053
|
[23] |
Y. Zhang, N.R. Tao, and K. Lu, Mechanical properties and rolling behaviors of nano-grained copper with embedded nano-twin bundles, Acta Mater., 56(2008), No. 11, p. 2429. doi: 10.1016/j.actamat.2008.01.030
|
[24] |
N. Hansen, Hall–Petch relation and boundary strengthening, Scripta Mater., 51(2004), No. 8, p. 801. doi: 10.1016/j.scriptamat.2004.06.002
|
[25] |
Y. Liu, Z. Li, Y.X. Jiang, Y. Zhang, Z.Y. Zhou, and Q. Lei, The microstructure evolution and properties of a Cu–Cr–Ag alloy during thermal-mechanical treatment, J. Mater. Res., 32(2017), No. 7, p. 1324. doi: 10.1557/jmr.2017.17
|
[26] |
K. Yamaguchi, T. Ishigaki, Y. Inoue, et al., Comprehensive elemental screening of solid-solution copper alloys, Sci. Technol. Adv. Mater.: Methods, 3(2023), No. 1, art. No. 2250704. doi: 10.1080/27660400.2023.2250704
|
[27] |
Y. Abe, S. Semboshi, N. Masahashi, S.H. Lim, E.A. Choi, and S.Z. Han, Mechanical strength and electrical conductivity of Cu–In solid solution alloy wires, Metall. Mater. Trans. A, 54(2023), No. 3, p. 928. doi: 10.1007/s11661-022-06938-1
|