Jun Shen, Yongchang Liu, and Houxiu Gao, Rapid directional solidification in Sn-Cu lead-free solder, J. Univ. Sci. Technol. Beijing, 13(2006), No. 4, pp. 333-337. https://doi.org/10.1016/S1005-8850(06)60069-8
Cite this article as:
Jun Shen, Yongchang Liu, and Houxiu Gao, Rapid directional solidification in Sn-Cu lead-free solder, J. Univ. Sci. Technol. Beijing, 13(2006), No. 4, pp. 333-337. https://doi.org/10.1016/S1005-8850(06)60069-8
Jun Shen, Yongchang Liu, and Houxiu Gao, Rapid directional solidification in Sn-Cu lead-free solder, J. Univ. Sci. Technol. Beijing, 13(2006), No. 4, pp. 333-337. https://doi.org/10.1016/S1005-8850(06)60069-8
Citation:
Jun Shen, Yongchang Liu, and Houxiu Gao, Rapid directional solidification in Sn-Cu lead-free solder, J. Univ. Sci. Technol. Beijing, 13(2006), No. 4, pp. 333-337. https://doi.org/10.1016/S1005-8850(06)60069-8
An experimental study on the microstructures of a rapid directionally solidified metallo-eutectic Sn-Cu alloy was carried out. This material is an important alloy that is used as a lead-free solder. The results showed that the kinetic undercooling due to the rapid solidification process led to the formation of a pseudoeutectic zone, whereas the hypereutectic reaction produced the regular lamellar structure in the hypereutectic Sn-1.0Cu alloy. The corresponding arm spacing in the obtained lamellar phases decreased gradually with the increase of the applied cooling rate, which corresponded well with the prediction of a rapid directional solidification model.
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