Yuanli Wang, Delu Liu, Weiran Shao, Jie Fu, Yonglin Kang, Deguang Zhou, and Zhongbing Wang, Influence of copper on quality of hot strips by EAF-CSP process, J. Univ. Sci. Technol. Beijing, 11(2004), No. 1, pp. 57-61.
Cite this article as:
Yuanli Wang, Delu Liu, Weiran Shao, Jie Fu, Yonglin Kang, Deguang Zhou, and Zhongbing Wang, Influence of copper on quality of hot strips by EAF-CSP process, J. Univ. Sci. Technol. Beijing, 11(2004), No. 1, pp. 57-61.
Yuanli Wang, Delu Liu, Weiran Shao, Jie Fu, Yonglin Kang, Deguang Zhou, and Zhongbing Wang, Influence of copper on quality of hot strips by EAF-CSP process, J. Univ. Sci. Technol. Beijing, 11(2004), No. 1, pp. 57-61.
Citation:
Yuanli Wang, Delu Liu, Weiran Shao, Jie Fu, Yonglin Kang, Deguang Zhou, and Zhongbing Wang, Influence of copper on quality of hot strips by EAF-CSP process, J. Univ. Sci. Technol. Beijing, 11(2004), No. 1, pp. 57-61.
Electron microscopy and X-ray Energy Dispersive Spectroscopy (XEDS) study on influence of Cu on low carbon hot strips produced by CSP (Compact Strip Production) process has been carried out. The results indicated that copper segregation and enrichment at interfacial layer between oxidized surface and steel matrix is the key factor, which results in microcracks and edge flaws on the strips. The primary considerations to prevent detrimental effects from Cu include controlling copper content in proper level, higher soaking temperature and non-oxidizable atmosphere during soaking. Copper sulfide precipitates with nanometers in size were observed, they may be beneficial to the properties of CSP products, and influence of Cu on quality of CSP hot strips is discussed.
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