Microstructure Study on Semi-solid 60Si2Mn during Compressing

The microstructure behavior and deformation mechanism of semi-solid 60Si2Mn fabricated by electromagnetic stirring under different deformation conditions during thixoforming are studied by means of Gleeble-1500 thermal-strain-stress simulator. The micro-structure of deformed 60Si2Mn and that of the non-deformed are compared. The results show that the grain size within deformation zone decreases as the amount of deformation increases or deformation temperature decreases, but deformation fate has small effect on grain size when the rate is very low. Besides, there is a critical amount of deformation to reduce grain size. These results offer theoretical and experimental basis for further producing semi-solid material with high melting temperature and direct forming of semi-solid slurry.