Wenhuai Tian, Hongye Gao, Ailing Fan, Xiaoou Shan,  and Qi Sun, Microstructure and texture of electroformed copper liners of shaped charges, J. Univ. Sci. Technol. Beijing, 9(2002), No. 4, pp. 265-268.
Cite this article as:
Wenhuai Tian, Hongye Gao, Ailing Fan, Xiaoou Shan,  and Qi Sun, Microstructure and texture of electroformed copper liners of shaped charges, J. Univ. Sci. Technol. Beijing, 9(2002), No. 4, pp. 265-268.
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Microstructure and texture of electroformed copper liners of shaped charges

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    Wenhuai Tian    E-mail: wenhuaitian@sina.com

  • Received: 2 November 2001
  • The microstructures of copper liners of shaped charges prepared by electroforming technique were investigated by transmission electron microscopy (TEM). Meanwhile, the orientations distributing of thegrains in the electroformed copper liners of shaped charges was examined by the electron backscattering Kikuchi pattern (EBSP) technique. TEM observations have revealed that these electroformed copper liners of shaped charges have the grain size of about 1-3μm and the grains have a preferential orientation distribution along the growth direction.EBSP analysis has demonstrated that the as-formed copper liners of shaped charges exhibit a micro-texture, i.e. one type of fiber texture, and the preferred growth direction is normal to the surface of the liners.
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