Huiping Duan, Jun Luo, Karl-Heinz Bohm,  and Mustafa Koçak, Effect of the formation process of transient liquid phase (TLP) on the interface structure of TiAl joints, J. Univ. Sci. Technol. Beijing, 12(2005), No. 5, pp. 431-435.
Cite this article as:
Huiping Duan, Jun Luo, Karl-Heinz Bohm,  and Mustafa Koçak, Effect of the formation process of transient liquid phase (TLP) on the interface structure of TiAl joints, J. Univ. Sci. Technol. Beijing, 12(2005), No. 5, pp. 431-435.
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Effect of the formation process of transient liquid phase (TLP) on the interface structure of TiAl joints

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  • Corresponding author:

    Huiping Duan    E-mail: hpduan@yahoo.com

  • Received: 7 July 2004
  • TiAl has been joined employing the transient liquid phase (TLP) bonding with Ti combined with Cu, Ni or Fe foils. Experimental results showed that though the interface structures of the joints are quite different, all the joined zones are composed of five sublayers, i.e. two diffusion zones, two interfacial zones and an interlayer. It has been convinced that the formation process of the transient liquid phase controls the diffusion behavior of melting point depressant (MPD) Cu, Ni, and Fe atoms, which leads to form different interface structures of the joints.
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