Solid state interfacial reactions in electrodeposited Ni/Sn couples

Wen-ming Tang; An-qiang He; Qi Liu; Douglas-G. Ivey

doi:10.1007/s12613-010-0341-5

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Wen-ming Tang, An-qiang He, Qi Liu, and Douglas-G. Ivey, Solid state interfacial reactions in electrodeposited Ni/Sn couples, Int. J. Miner. Metall. Mater., 17(2010), No. 4, pp.459-463. https://dx.doi.org/10.1007/s12613-010-0341-5

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Solid state interfacial reactions in electrodeposited Ni/Sn couples

摘要: Ni/Sn couples, prepared by sequentially electroplating Ni layers and Sn layers on metallized Si wafers, were employed to study the microstructures and growth kinetics of Ni-Sn intermediate phases, when the Ni/Sn couples were aged at room temperature or annealed at temperatures from 150 to 225℃ for various times. The results show that the NiSn phase and Ni₃Sn₄ phase are formed, respectively, in the aged couples and annealed couples. The Ni₃Sn₄ layer is continuously distributed between the Ni and Sn sides in the annealed Ni/Sn couples. The Ni₃Sn₄ growth follows parabolic growth kinetics with an apparent activation energy of 39.0 kJ/mol.

Solid state interfacial reactions in electrodeposited Ni/Sn couples

Abstract: Ni/Sn couples, prepared by sequentially electroplating Ni layers and Sn layers on metallized Si wafers, were employed to study the microstructures and growth kinetics of Ni-Sn intermediate phases, when the Ni/Sn couples were aged at room temperature or annealed at temperatures from 150 to 225℃ for various times. The results show that the NiSn phase and Ni₃Sn₄ phase are formed, respectively, in the aged couples and annealed couples. The Ni₃Sn₄ layer is continuously distributed between the Ni and Sn sides in the annealed Ni/Sn couples. The Ni₃Sn₄ growth follows parabolic growth kinetics with an apparent activation energy of 39.0 kJ/mol.

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