Abstract: The microstructural formation and properties of Sn-2.5Bi-xIn-1Zn-0.3Ag (in wt%) alloys and the evolution of soldered interfaces on a Cu substrate were investigated. Apart from the relatively low melting point (about 195℃), which is close to that of conventional eutectic Sn-Pb solder, the investigated solder presents superior wettability, solderability, and ductility. The refined equiaxial grains enhance the mechanical properties, and the embedded bulk intermetallic compounds (IMCs) (Cu₆Sn₅ and Cu₅Zn₈) and granular Bi particles improve the joint reliability. The addition of In reduces the solubility of Zn in the β-Sn matrix and strongly influences the separation and growth behaviors of the IMCs. The soldered interface of Sn-2.5Bi-xIn-1Zn-0.3Ag/Cu consists of Cu-Zn and Cu-Sn IMC layers.