多层 Ti/Al/Nb 复合界面变形后退火过程中金属间化合物的生长行为

R. Jafari; B. Eghbali

doi:10.1007/s12613-021-2263-9

Volume 29 Issue 8

Aug. 2022

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文章导航 > 矿物冶金与材料学报（英文） > 2022 > 29(8): 1608-1617

R. Jafariand B. Eghbali, Intermetallic growth behavior during post deformation annealing in multilayer Ti/Al/Nb composite interfaces, Int. J. Miner. Metall. Mater., 29(2022), No. 8, pp. 1608-1617. https://doi.org/10.1007/s12613-021-2263-9

Cite this article as:

R. Jafariand B. Eghbali, Intermetallic growth behavior during post deformation annealing in multilayer Ti/Al/Nb composite interfaces, Int. J. Miner. Metall. Mater., 29(2022), No. 8, pp. 1608-1617. https://doi.org/10.1007/s12613-021-2263-9

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研究论文

多层 Ti/Al/Nb 复合界面变形后退火过程中金属间化合物的生长行为

R. Jafari¹,
B. Eghbali^2,

1)
Department of Materials Engineering, Faculty of Engineering, Urmia University, P.O. Box 57561-165, Urmia, Iran
2)
Faculty of Materials Engineering, Sahand University of Technology, P.O. Box 51335-1996, Tabriz, Iran

通讯作者:
B. Eghbali E-mail: eghbali@sut.ac.ir

中文摘要

三金属Ti–Al–Nb复合材料通过三个程序进行加工：热压、轧制和热压，然后进行后续轧制。然后将制造的复合材料在 600、625 和 650°C 的温度下退火不同时间。界面处的显微组织观察表明，塑性变形应变的增加显着影响了 TiAl₃金属间化合物层的演化并加速了层的生长。相反，施加的应变量不会显着影响 NbAl₃ 金属间化合物层厚度的演变。还发现Al和Ti原子在整个TiAl₃层中发生了扩散，但只有Al原子在NbAl₃层中扩散。 NbAl₃ 金属间化合物层生长缓慢是由于 Nb 原子缺乏扩散和 Al 原子与 Nb 原子反应的高活化能所致。

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Research Article

Intermetallic growth behavior during post deformation annealing in multilayer Ti/Al/Nb composite interfaces

R. Jafari¹ and
B. Eghbali^2,

+ Author Affiliations

Abstract

Abstract

The tri-metal Ti–Al–Nb composites were processed through three procedures: hot pressing, rolling, and hot pressing, followed by subsequent rolling. The fabricated composites were then subjected to annealing at 600, 625, and 650°C temperatures at different times. Microstructure observation at the interfaces reveals that the increase in plastic deformation strain significantly affects TiAl₃ intermetallic layers’ evolution and accelerates the layers’ growth. On the contrary, the amount of applied strain does not significantly affect the evolution of the NbAl₃ intermetallic layer thickness. It was also found that Al and Ti atoms’ diffusion has occurred throughout the TiAl₃ layer, but only Al atoms diffuse through the NbAl₃ layer. The slow growth rate of the NbAl₃ intermetallic layer is due to the lack of diffusion of Nb atoms and the high activation energy of Al atoms’ reaction with Nb atoms.
- intermetallic compounds;
- diffusion;
- Ti/Al/Nb composite;
- deformation;
- annealing

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References

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多层 Ti/Al/Nb 复合界面变形后退火过程中金属间化合物的生长行为

中文摘要

Intermetallic growth behavior during post deformation annealing in multilayer Ti/Al/Nb composite interfaces

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