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Xiaoyan Liu, Fangyuan Sun, Luhua Wang, Zhanxun Che, Guangzhu Bai, Xitao Wang, Jinguo Wang, Moon J. Kim, and Hailong Zhang, Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface, Int. J. Miner. Metall. Mater.,(2021). https://doi.org/10.1007/s12613-021-2336-9
Cite this article as:
Xiaoyan Liu, Fangyuan Sun, Luhua Wang, Zhanxun Che, Guangzhu Bai, Xitao Wang, Jinguo Wang, Moon J. Kim, and Hailong Zhang, Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface, Int. J. Miner. Metall. Mater.,(2021). https://doi.org/10.1007/s12613-021-2336-9
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  • Research Article

    Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface

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    • The thermal conductivity of diamond particles reinforced copper matrix  composite as an attractive thermal management material is significantly lowered by the non-wetting heterointerface. The paper investigates the heat transport behavior between a 200 nm Cu layer and a single-crystalline diamond substrate inserted by a chromium (Cr) interlayer having a series of thicknesses from 150 nm down to 5 nm. The purpose is to detect the impact of the modifying interlayer thickness on the interfacial thermal conductance (h) between Cu and diamond. The time-domain thermoreflectance measurements suggest that the introduction of Cr interlayer dramatically improves the h between Cu and diamond owing to the enhanced interfacial adhesion and bridged dissimilar phonon states between Cu and diamond. The h value exhibits a decreasing trend as the Cr interlayer becomes thicker because of the increase in thermal resistance of Cr interlayer. The high h values are observed for the Cr interlayer thicknesses below 21 nm since phononic transport channel dominates the thermal conduction in the ultrathin Cr layer. The findings provide a way to tune the thermal conduction across the metal/nonmetal heterogeneous interface, which plays a pivotal role in designing materials and devices for thermal management applications.

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