Songping Wu, Haoli Qin, and Pu Li, Preparation of fine copper powders and their application in BME-MLCC, J. Univ. Sci. Technol. Beijing, 13(2006), No. 3, pp. 250-255. https://doi.org/10.1016/S1005-8850(06)60053-4
Cite this article as:
Songping Wu, Haoli Qin, and Pu Li, Preparation of fine copper powders and their application in BME-MLCC, J. Univ. Sci. Technol. Beijing, 13(2006), No. 3, pp. 250-255. https://doi.org/10.1016/S1005-8850(06)60053-4
Songping Wu, Haoli Qin, and Pu Li, Preparation of fine copper powders and their application in BME-MLCC, J. Univ. Sci. Technol. Beijing, 13(2006), No. 3, pp. 250-255. https://doi.org/10.1016/S1005-8850(06)60053-4
Citation:
Songping Wu, Haoli Qin, and Pu Li, Preparation of fine copper powders and their application in BME-MLCC, J. Univ. Sci. Technol. Beijing, 13(2006), No. 3, pp. 250-255. https://doi.org/10.1016/S1005-8850(06)60053-4
The preparation of fine copper powders by chemical reduction method was investigated. The reaction of [Cu(NH3)4]2+ complex with hydrazine hydrate gives spherical monodispersed fine copper powders. The spherical copper powder with a uniform size of 3.5 ± 0.5 μm was processed to obtain flake copper powder having a uniform size of 8-10 μm, excellent dispersibility and uniform shape. The spherical copper powder of 2.5 ± 0.3 μm in size, flake copper, glass frit and vehicle were mixed to prepare copper paste, which was fired in 910-920°C to obtain BME-MLCC (base metal multilayer ceramic capacitor) with a dense surface of end termination, high adhesion and qualified electrical behavior. Polarized light photo and SEM were employed to observe the copper end termination of BME-MLCC. The rough interface from the interfacial reaction between glass and chip gives high adhesion.
The preparation of fine copper powders by chemical reduction method was investigated. The reaction of [Cu(NH3)4]2+ complex with hydrazine hydrate gives spherical monodispersed fine copper powders. The spherical copper powder with a uniform size of 3.5 ± 0.5 μm was processed to obtain flake copper powder having a uniform size of 8-10 μm, excellent dispersibility and uniform shape. The spherical copper powder of 2.5 ± 0.3 μm in size, flake copper, glass frit and vehicle were mixed to prepare copper paste, which was fired in 910-920°C to obtain BME-MLCC (base metal multilayer ceramic capacitor) with a dense surface of end termination, high adhesion and qualified electrical behavior. Polarized light photo and SEM were employed to observe the copper end termination of BME-MLCC. The rough interface from the interfacial reaction between glass and chip gives high adhesion.
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