Qiang Li and Weiping Shen, Design and optimization of W/Cu divertor mock-ups, J. Univ. Sci. Technol. Beijing, 14(2007), No. 2, pp. 157-159. https://doi.org/10.1016/S1005-8850(07)60031-0
Cite this article as:
Qiang Li and Weiping Shen, Design and optimization of W/Cu divertor mock-ups, J. Univ. Sci. Technol. Beijing, 14(2007), No. 2, pp. 157-159. https://doi.org/10.1016/S1005-8850(07)60031-0
Qiang Li and Weiping Shen, Design and optimization of W/Cu divertor mock-ups, J. Univ. Sci. Technol. Beijing, 14(2007), No. 2, pp. 157-159. https://doi.org/10.1016/S1005-8850(07)60031-0
Citation:
Qiang Li and Weiping Shen, Design and optimization of W/Cu divertor mock-ups, J. Univ. Sci. Technol. Beijing, 14(2007), No. 2, pp. 157-159. https://doi.org/10.1016/S1005-8850(07)60031-0
Lab of Special Ceramics and P/M, Research and Training Center on Fusion Reactor Materials, University of Science and Technology Beijing, Beijing 100083, China
Tungsten is a promising candidate for plasma-facing materials to cover the surface of the divertor plate in the design of an international thermonuclear experimental reactor (ITER). Copper as a heat sink material serves to transfer heat excellently. Divertor mock-ups with W/Cu graded interlayers were designed to reduce thermal stresses. Thermally induced stresses and temperature in a W/Cu divertor mock-up were analyzed using the finite element method. The graded structures with different exponents p and thicknesses were designed and discussed. The conclusions drawn from these analyses are that thermal stresses reach the minimum and the temperature is suitable when exponent p is 1.5 and the thickness of five graded interlayers is 5 mm.
Lab of Special Ceramics and P/M, Research and Training Center on Fusion Reactor Materials, University of Science and Technology Beijing, Beijing 100083, China
Tungsten is a promising candidate for plasma-facing materials to cover the surface of the divertor plate in the design of an international thermonuclear experimental reactor (ITER). Copper as a heat sink material serves to transfer heat excellently. Divertor mock-ups with W/Cu graded interlayers were designed to reduce thermal stresses. Thermally induced stresses and temperature in a W/Cu divertor mock-up were analyzed using the finite element method. The graded structures with different exponents p and thicknesses were designed and discussed. The conclusions drawn from these analyses are that thermal stresses reach the minimum and the temperature is suitable when exponent p is 1.5 and the thickness of five graded interlayers is 5 mm.
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