Cite this article as:

HU Mao-pu, WANG Bao-jue, and QIN Yong, Electroless Deposition of Nickel-phosphorus Alloy—on the Surface Submitted to Cathodic Pulse Current, J. Univ. Sci. Technol. Beijing , 1(1994), No. 1-2, pp.90-96.
HU Mao-pu, WANG Bao-jue, and QIN Yong, Electroless Deposition of Nickel-phosphorus Alloy—on the Surface Submitted to Cathodic Pulse Current, J. Univ. Sci. Technol. Beijing , 1(1994), No. 1-2, pp.90-96.
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阴极脉冲电流作用下的Ni-P合金化学镀过程

摘要: 研究了Mi-P合金脉冲化学镀过程,找出了镀层P含量,镀速和脉冲电流参数,温度的关系。由于脉冲电流的作用,可以减缓镀液中亚磷酸盐的积累,并且P的化学沉积过程也得到加速。

 

Electroless Deposition of Nickel-phosphorus Alloy—on the Surface Submitted to Cathodic Pulse Current

Abstract: The pulsed electroless deposition of nickel-phosphorus has thoroughly been investigated to find out the relationship of phosphorus content in deposits and deposition rate with parameters of pulse current and temperature. The accumulation of phosphite in the electroless nickel plating solution can be improved due to using pulse current. Futhermore, it was discovered that the reaction of the pure electroless nickel deposition was accelerated by the pulse current.

 

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