Fabrication and characterization of Cu-Zn-Sn shape memory alloys via an electrodeposition-annealing route

Richard Espiritu; Alberto Amorsolo Jr.

doi:10.1007/s12613-019-1886-6

Volume 26 Issue 11

Nov. 2019

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Article Navigation > International Journal of Minerals, Metallurgy and Materials > 2019 > 26(11): 1436-1449

Richard Espirituand Alberto Amorsolo Jr., Fabrication and characterization of Cu-Zn-Sn shape memory alloys via an electrodeposition-annealing route, Int. J. Miner. Metall. Mater., 26(2019), No. 11, pp. 1436-1449. https://doi.org/10.1007/s12613-019-1886-6

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Richard Espirituand Alberto Amorsolo Jr., Fabrication and characterization of Cu-Zn-Sn shape memory alloys via an electrodeposition-annealing route, Int. J. Miner. Metall. Mater., 26(2019), No. 11, pp. 1436-1449. https://doi.org/10.1007/s12613-019-1886-6

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Research Article

Fabrication and characterization of Cu-Zn-Sn shape memory alloys via an electrodeposition-annealing route

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Corresponding author:
Richard Espiritu E-mail: richard.espiritu@coe.upd.edu.ph
Received: 26 November 2018; Revised: 24 June 2019; Accepted: 24 June 2019

Abstract

Abstract

Cu-Zn-Sn shape memory alloys (SMAs) with an average composition of 56.0at%, 36.1at%, and 7.9at% for Cu, Zn, and Sn, respectively, were successfully fabricated via an electrodeposition-annealing route. The produced SMAs were assessed for shape memory response in terms of percent displacement (martensite phase recovery) by subjecting the ternary alloys to flame tests and subsequently characterizing them via differential scanning calorimetry (DSC), optical microscopy, scanning electron microscopy in conjunction with energy-dispersive spectroscopy (SEM-EDS), and X-ray diffraction (XRD) analysis. The flame tests showed that the highest displacement was ca. 93%, with average austenite and martensitic start transformation temperature of 225℃ and 222℃, respectively. XRD analysis revealed that the intermetallic phases responsible for the observed shape memory properties have substitutional Zn in the lattice occupied by Cu and Sn, leading to the formation of Cu(Zn,Sn) and Cu₆(Zn,Sn)₅ variants. The formation of these variants was attributed to the faster interdiffusion of Cu into Sn, driven by an activation energy of 34.82 kJ·mol^-1. Five cycles of repeated torching-annealing revealed an essentially constant shape memory response, suggesting that the fabricated SMAs were consistent and sufficiently reliable for their intended service application.
- electrodeposition;
- annealing;
- intermetallics;
- martensitic transformation;
- shape memory alloy

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[1]	K. Otsuka and C.M. Wayman, Shape Memory Materials, Cambridge University Press, United Kingdom, 1999.
[2]	D.C. Lagoudas, Shape Memory Alloys:Modeling and Engineering Applications, Springer Science & Business Media, New York, 2008, p. 1.
[3]	J.M. Jani, M. Leary, A. Subic, and M.A. Gibson, A review of shape memory alloy research, applications and opportunities, Mater. Des., 56(2014), p. 1078.
[4]	W.M. Huang, Z. Ding, C.C. Wang, J. Wei, Y. Zhao, and H. Purnawali, Shape memory materials, Mater. Today, 13(2010), No. 7-8, p. 54.
[5]	R.A. Ahmed, A comparative study on the corrosion performance of Ni₄₇Ti₄₉Co₄ and Ni₅₁Ti₄₉ shape memory alloys in simulated saliva solution for dental applications, Acta Metall. Sin. (Engl. Lett.), 29(2016), No. 11, p. 1001.
[6]	L. Petrini and F. Migliavacca, Biomedical applications of shape memory alloys, J. Metall., 2011(2011), art No. 501483
[7]	D. Quan and X. Hai, Shape memory alloy in various aviation field, Procedia Eng., 99(2015), p. 1241.
[8]	S. Wang, K. Tsuchiya, L. Wang, and M. Umemoto, Deformation mechanism and stabilization of martensite in TiNi shape memory alloy, J. Mater. Sci. Technol., 26(2010), No. 10, p. 936.
[9]	B.C. Zhang, J. Chen, and C. Coddet, Microstructure and transformation behavior of in-situ shape memory alloys by selective laser melting Ti-Ni mixed powder, J. Mater. Sci. Technol., 29(2013), No. 9, p. 863.
[10]	H.J. Jiang, S.S. Cao, C.B. Ke, X.P. Ma, and X.P. Zhang, Fine-grained bulk NiTi shape memory alloy fabricated by rapid solidification process and its mechanical properties and damping performance, J. Mater. Sci. Technol., 29(2013), No. 9, p. 855.
[11]	C.Y. Chung and C.W.H. Lam, Cu-based shape memory alloys with enhanced thermal stability and mechanical properties, Mater. Sci. Eng. A, 273-275(1999), p. 622.
[12]	R. Dasgupta, A look into Cu-based shape memory alloys:Present scenario and future prospects, J. Mater. Res., 29(2014), No. 16, p. 1681.
[13]	E. Patoor, D.C. Lagoudas, P.B. Entchev, L.C. Brinson, and X.J. Gao, Shape memory alloys, Part I:General properties and modeling of single crystals, Mech. Mater., 38(2006), No. 5-6, p. 391.
[14]	S. Ozgen and C. Tatar, Thermoelastic transition kinetics of a gamma irradiated CuZnAl shape memory alloy, Met. Mater. Int., 18(2012), No. 6, p. 909.
[15]	H. Funakubo and J.B. Kennedy, Shape Memory Alloys, Gordon and Breach Science Publishers, New York, 1987.
[16]	M. Ahlers, Martensite and equilibrium phases in CuZn and CuZnAl alloys, Prog. Mater. Sci., 30(1986), No. 3, p. 135.
[17]	D.Y. Li, S.L. Zhang, W.B. Liao, G.H. Geng, and Y. Zhang, Superelasticity of Cu-Ni-Al shape memory fibers prepared by melt extraction technique, Int. J. Miner. Metall. Mater., 23(2016), No. 8, p. 928.
[18]	Z.G. Wang, X.T. Zu, and Y.Q. Fu, Review on the temperature memory effect in shape memory alloys, Int. J. Smart Nano Mater., 2(2011), No. 3, p. 101.
[19]	S. Miyazaki and K. Otsuka, Development of shape memory alloys, ISIJ Int., 29(1989), No. 5, p. 353.
[20]	U. Sari, Influences of 2.5wt% Mn addition on the microstructure and mechanical properties of Cu-Al-Ni shape memory alloys, Int. J. Miner. Metall. Mater., 17(2010), No. 2, p. 192.
[21]	G.B. Narasimha and S.M. Murigendrappa, Effect of zirconium on the properties of polycrystalline Cu-Al-Be shape memory alloy, Mater. Sci. Eng. A, 755(2019), p. 211.
[22]	X. Hu, Y.F. Zheng, Y.X. Tong, F. Chen, B. Tian, H.M. Zhou, and L. Li, High damping capacity in a wide temperature range of a compositionally graded TiNi alloy prepared by electroplating and diffusion annealing, Mater. Sci. Eng. A, 623(2015), p. 1.
[23]	P. Fricoteaux and C. Rousse, Nanowires of Cu-Zn and Cu-Zn-Al shape memory alloys elaborated via electrodeposition in ionic liquid, J. Electroanal. Chem., 733(2014), p. 53.
[24]	İ.H. Karahan and R. Özdemir, Effect of Cu concentration on the formation of Cu_1-xZn_x shape memory alloy thin films, Appl. Surf. Sci., 318(2014), p. 100.
[25]	S. Pourkhorshidi, N. Parvin, M.S. Kenevisi, M. Naeimi, and H.E. Khaniki, A study on the microstructure and properties of Cu-based shape memory alloy produced by hot extrusion of mechanically alloyed powders, Mater. Sci. Eng. A, 556(2012), p. 658.
[26]	S.H. Kang, S.G. Hur, H.W. Lee, and T.H. Nam, Microstructures and transformation behavior of Ti-Ni-Cu shape memory alloy powders fabricated by ball milling method, Met. Mater., 6(2000), No. 4, p. 381.
[27]	T.H. Nam and S.H. Kang, Effect of ball milling conditions on the microstructure and the transformation behavior of Ti-Ni and Ti-Ni-Cu shape memory alloy powders, Met. Mater. Int., 8(2002), No. 2, p. 145.
[28]	K. Mehrabi, M. Brunčko, A.C. Kneissl, M. Čolič, D. Stamenković, J. Ferčec, I. Anžel, and R. Rudolf, Characterisation of melt spun Ni-Ti shape memory Ribbons' microstructure, Met. Mater. Int., 18(2012), No. 3, p. 413.
[29]	M. Izadinia and K. Dehghani, Microstructural evolution and mechanical properties of nanostructured Cu-Al-Ni shape memory alloys, Int. J. Miner. Metall. Mater., 19(2012), No. 4, p. 333.
[30]	A. Agrawal and R.K. Dube, Methods of fabricating Cu-Al-Ni shape memory alloys, J. Alloys Compd., 750(2018), p. 235.
[31]	M. Schetky, Intermetallic Compounds, John Wiley and Sons, New York, 1994, p. 529.
[32]	M. Schlesinger and M. Paunovic, Fundamentals of Electrochemical Deposition, 2nd Ed., Wiley Interscience, New Jersey, 2006.
[33]	E.A. Brandes and G. Brook, Smithells Metals Reference Book, 7th Ed., Butterworth-Heinemann, Oxford, 1992.
[34]	R.D.V. Espiritu and A.V. Amorsolo Jr., SEM-EDX analysis of intermetallic phases in a Cu-Zn-Sn shape memory alloy, Microsc. Anal., 24(2010), No. 6, p. 15.
[35]	M.S. Suh, C.J. Park, and H.S. Kwon, Growth kinetics of Cu-Sn intermetallic compounds at the interface of a Cu substrate and 42Sn-58Bi electrodeposits, and the influence of the intermetallic compounds on the shear resistance of solder joints, Mater. Chem. Phys., 110(2008), No. 1, p. 95.
[36]	B.F. Dyson, T.R. Anthony, and D. Turnbull, Interstitial diffusion of copper in tin, J. Appl. Phys., 38(1967), No. 8, p. 3408.
[37]	A. Churakova, D. Gunderov, A. Lukyanov, and N. Nollmann, Transformation of the TiNi alloy microstructure and the mechanical properties caused by repeated B2-B19' martensitic transformations, Acta Metall. Sin. (Engl. Lett.), 28(2015), No. 10, p. 1230.
[38]	H.Y. Kim and S. Miyazaki, Ni-Free Ti-Based Shape Memory Alloys, Butterworth-Heinemann, Oxford, 2018, p. 193.
[39]	R.D.V. Espiritu and A.V. Amorsolo Jr., DSC analysis of Cu-Zn-Sn shape memory alloy fabricated via electrodeposition route, J. Therm. Anal. Calorim., 107(2012), No. 2, p. 483.
[40]	T.W. Liu, Y.J. Zheng, and L.S. Cui, Transformation sequence rule of martensite plates and temperature memory effect in shape memory alloys, Acta Metall. Sin. (Engl. Lett.), 28(2015), No. 10, p. 1286.