Tungsten nanoparticle-strengthened copper composite prepared by a sol-gel method and in-situ reaction

Tungsten nanoparticle-strengthened Cu composites were prepared from nanopowder synthesized by a sol-gel method and in-situ hydrogen reduction. The tungsten particles in the Cu matrix were well-dispersed with an average size of approximately 100-200 nm. The addition of nanosized W particles remarkably improves the mechanical properties, while the electrical conductivity did not substantially decrease. The Cu-W composite with 6wt% W has the most comprehensive properties with an ultimate strength of 310 MPa, yield strength of 238 MPa, hardness of HV 108 and electrical conductivity of 90% IACS. The enhanced mechanical property and only a small loss of electrical conductivity demonstrate the potential of this new strategy to prepare W nanoparticle-strengthened Cu composites.