Effect of Pd ions in the chemical etching solution
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Graphical Abstract
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Abstract
The acrylonitrile-butadiene-styrene (ABS) surface was etched by dipping it into chromic acid-sulfuric acid containing a trace amount of palladium. The surface roughness, activity, and valence bond were characterized by atomic force microscopy (AFM) and X-ray photoelectron spectroscopy (XPS). The results showed that with the increase of Pd concentration in the etching solution the ABS surface roughness reduced. The ratio of O to C increases and forms a large amount of O=C-O functional groups by dipping into Pd contained etching solution, thus the amount of colloids palladium adsorption increases. The carboxyl group acts as the adsorption site for the Pd/Sn catalyst.
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