Jun Zhou, Zhe Wu, and Zhanhe Liu, Influence and determinative factors of ion-to-atom arrival ratio in unbalanced magnetron sputtering systems, J. Univ. Sci. Technol. Beijing , 15(2008), No. 6, pp.775-781. https://dx.doi.org/10.1016/S1005-8850(08)60286-8
Cite this article as: Jun Zhou, Zhe Wu, and Zhanhe Liu, Influence and determinative factors of ion-to-atom arrival ratio in unbalanced magnetron sputtering systems, J. Univ. Sci. Technol. Beijing , 15(2008), No. 6, pp.775-781. https://dx.doi.org/10.1016/S1005-8850(08)60286-8
Materials

Influence and determinative factors of ion-to-atom arrival ratio in unbalanced magnetron sputtering systems

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  • Low pressure sputtering with a controlled ratio of ion flux to deposited atom flux at the condensing surface is one of the main directions of development of magnetron sputtering methods. Unbalanced magnetron sputtering, by producing dense secondary plasma around the substrate, provides a high ion current density. The closed-field unbalanced magnetron sputtering system (CFUBMS) has been established as a versatile technique for high-rate deposition high-quality metal, alloy, and ceramic thin films. The'key factor in the CFUBMS system is the ability to transport high ion currents to the substrate, which can enhance the formation of full dense coatings at relatively low value homologous temperature. The investigation shows that the energy of ions incidenced at the substrate and the ratio of the flux of these ions to the flux of condensing atoms are the fundamental parameters in determining the structure and properties of films produced by ion-assisted deposition processes. Increasing ion bombardment during deposition combined with increasing mobility of the condensing atoms favors the formation of a dense microstructure and a smooth surface.
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