Jian-hua Liu, Ming Li, Song-mei Li,  and Min Huang, Effect of the microstructure of Al 7050-T7451 on anodic oxide formation in sulfuric acid, Int. J. Miner. Metall. Mater., 16(2009), No. 4, pp. 432-438. https://doi.org/10.1016/S1674-4799(09)60076-5
Cite this article as:
Jian-hua Liu, Ming Li, Song-mei Li,  and Min Huang, Effect of the microstructure of Al 7050-T7451 on anodic oxide formation in sulfuric acid, Int. J. Miner. Metall. Mater., 16(2009), No. 4, pp. 432-438. https://doi.org/10.1016/S1674-4799(09)60076-5
Materials

Effect of the microstructure of Al 7050-T7451 on anodic oxide formation in sulfuric acid

+ Author Affiliations
  • Corresponding author:

    Jian-hua Liu    E-mail: liujh@buaa.edu.cn

  • Received: 26 June 2008
  • The effect of the microstructure of an Al 7050-T7451 substrate on the anodic oxide formation in sulfuric acid was studied in this article. The microstructure of the substrate was assessed by optical microscope (OM) and transmission electron microscope (TEM). The surface and cross-section morphologies of the oxide films were examined by scanning electron microscope (SEM). The chemical composition of intermetallic particles in the alloys and films was investigated using energy dispersive spectroscope (EDS). The roles of intermetallic phases and grain or subgrain boundaries on the oxide film formation were researched using the potentiodynamic and potentiostatic polarization technique in sulfuric acid solution. The results show that the transition of coarse intermetallic particles or grain (subgrain) boundaries at the surface of Al alloys can be characterized by potentiodynamic polarization curves. The surface and cross-section micrographs of the anodic layer seem to preserve the microstructure of the substrate. Large cavities in the anodic films are caused by the preferential dissolution of coarse AItCuMg particles and the entrance of Cu-rich remnants into the electrolyte during anodizing. The Al7Cu2Fe particles tend to be occluded in the oxide layer or lose from the oxide surface because of peripheral trenching. Small pores in the films are induced by the dissolution of precipitates in grain or subgrain boundaries. The film surface of recrystallized grain bodies is smooth and homogeneous.
  • loading
  • 加载中

Catalog

    通讯作者: 陈斌, bchen63@163.com
    • 1. 

      沈阳化工大学材料科学与工程学院 沈阳 110142

    1. 本站搜索
    2. 百度学术搜索
    3. 万方数据库搜索
    4. CNKI搜索

    Share Article

    Article Metrics

    Article Views(232) PDF Downloads(10) Cited by()
    Proportional views

    /

    DownLoad:  Full-Size Img  PowerPoint
    Return
    Return