Feng Tai, Fu Guo, Zhi-dong Xia, Yong-ping Lei, and Yao-wu Shi, Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints, Int. J. Miner. Metall. Mater., 16(2009), No. 6, pp. 677-684. https://doi.org/10.1016/S1674-4799(10)60012-X
Cite this article as:
Feng Tai, Fu Guo, Zhi-dong Xia, Yong-ping Lei, and Yao-wu Shi, Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints, Int. J. Miner. Metall. Mater., 16(2009), No. 6, pp. 677-684. https://doi.org/10.1016/S1674-4799(10)60012-X
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Effects of nano-sized Ag reinforcing particulates on the microstructure of Sn-0.7Cu solder joints

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  • Corresponding author:

    Fu Guo    E-mail: guofu@bjut.edu.cn

  • Received: 10 December 2008

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      沈阳化工大学材料科学与工程学院 沈阳 110142

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